Method for manufacturing flip chip and ball-bonding chip-stacked package structure
A technology of flip-chip and packaging structure, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., and can solve problems affecting the coplanarity of ball-bonded chip mounting, layering, and filling voids and space filling with plastic packaging materials. Insufficient and other problems, to achieve the effect of increasing thickness, reducing steps, and reducing layout space
Active Publication Date: 2017-10-10
JCET GROUP CO LTD
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
When the underfill climbs to the non-common energy area of the flip chip due to capillary phenomenon, the coplanarity of the ball bonded chip will be affected when the chip is mounted after the glue is drawn.
Since a part of the underfill glue overflows to the surface of the chip or the surface of the substrate outside the flip chip bonding area, the amount of underfill filling glue in the space between the solder balls at the bottom of the flip chip and the substrate will decrease accordingly, resulting in a flip chip Insufficient filling of the space between the bottom solder ball and the substrate further presents the risk of delamination and molding compound filling voids
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0036] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0037] Such as figure 2 As shown in the present embodiment, a flip chip and ball bonded chip stacked packaging structure includes a substrate 1, a plurality of solder pads 7 are arranged on the front of the substrate 1, and solder balls 2 pass through the solder pads 7. A flip chip 5 is provided, and a ball bonding chip 6 is arranged above the flip chip 5. A layer of adhesive film 8 is adhered to the non-functional area on the back of the ball bonding chip 6, and the adhesive film 8 covers the flip chip 5. And fill the space between the flip chip 5 and the substrate 1, the front of the ball bonded chip 6 is electrically connected to the substrate 1 through the metal wire 4, the substrate 1, the flip chip 5, the ball bonded chip 6 and the metal wire 4 The periphery is covered with a plastic encapsulant 9;
[0038] The adhesive film 8 adopts ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention relates to a method for manufacturing a flip chip and ball-bonding chip-stacked package structure. The method comprises the steps of 1, acquiring a substrate; 2, welding a flip chip on a plurality of bonding pads on the substrate by solder balls; 3, attaching a layer of adhesive film on a non-functional surface below the wafer of a ball-bonding chip, and simultaneously scribing and dividing the ball-bonding chip into units; 4, directly arranging the ball-bonding chip with the layer of adhesive film attached onto the non-functional surface to be above the flip chip, coating the flip chip with the adhesive film and fully filling the below space between the flip chip and the substrate; 5, curing the adhesive film; 6, after the curing of the adhesive film, conducting the bonding operation on the ball-bonding chip; 7, packaging the structure by using a molding compound. According to the technical scheme of the invention, an FOW film or an FOD film is adopted to replace the underfill filling adhesive of the flip chip and the loading adhesive of the ball-bonding chip. Therefore, the adverse effect of the ball-bonding chip on the flip chip arranged below the ball-bonding chip during the chip loading and wire bonding process can be eliminated.
Description
technical field [0001] The invention relates to a manufacturing method of a stacked packaging structure of flip chips and ball bonded chips, which improves the adverse effects of the upper layer of ball bonded chips on the lower layer of the flip chip during the chip loading and ball bonding operations in the existing structure, and belongs to Semiconductor packaging technology field. Background technique [0002] The existing stacked package structure in which the lower layer is a flip chip and the upper layer is a ball bonded chip, see figure 1 , the process steps are as follows: 1. First solder the flip chip to the substrate; 2. Fill the gap between the solder bumps under the flip chip with Underfill filler; 3. Then paint the non-functional surface of the ball bonded chip. 4. The ball-bonded chip is used for wire bonding; 5. Finally, it is encapsulated with a plastic encapsulant to protect the product structure. [0003] At present, there is only one layer of adhesive l...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/31
CPCH01L21/563H01L23/3114H01L23/3128H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
Inventor 殷炯龚臻刘怡
Owner JCET GROUP CO LTD