Wafer turning device

Abstract

The present invention discloses a wafer turning device for changing the arrangement of the wafer from flat to direct. The wafer steering device comprises a housing, a steering member and a wafer carrier. The housing includes an opening. The steering member is connected to the housing for rotating the housing so that the opening is rotated to the first or second direction. The wafer carrier is located in the housing to carry the wafer. The turn member rotates the housing so that the opening faces the second direction before the wafer is placed inside the housing from the outside in a flat manner. After the wafer is placed in the housing in a flat manner, the turn member rotates the housing so that the opening is oriented in the first direction and the wafer is carried on the wafer carrier, and the wafer is placed in a manner For the straight.

Description

technical field [0001] The invention relates to a wafer steering device, in particular to a wafer steering device which changes the way of placing wafers from flat laying to vertical laying, and converts wafers from different carriers. Background technique [0002] In the semiconductor manufacturing process, it is necessary to perform various processing processes on the wafer. In different processes, the carrier used to carry the wafer will not be used, and the way of placing the wafer will be different. When wafers are transferred between different carriers and different placement methods, many devices are used to safely transfer wafers between two different carriers. If it is necessary to place the wafer 300 flat on the platform or assembly line machine on the vertically placed carrier, if figure 1 As shown, it is necessary to use the robotic arm 400 to lift the flat wafer 300 first, and then put the flat wafer 300 into the temporary wafer storage box 500 . After the wa...

AI Technical Summary

Problems solved by technology

[0003] However, in the above-mentioned operation process of changing the carrier and changing the placement method, many machines are needed to assist in moving the wafer and temporarily placing the wafer, so these machines will take up a large space, and the operation process is difficult. time is also longer

Therefore, when the space requirement of the process machine is getting smaller and smaller, and the process time is shortened, the above-mentioned operation process cannot meet the use requirements.

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