Substrate processing equipment

Abstract

A confirmation unit (67) of a substrate treatment apparatus is provided with an inspection pipeline (671), a conductivity acquisition portion (672), and a determination portion (673). The inspection pipeline (671) includes a plurality of conductive portions (675) and a plurality of insulating portions (676) respectively extending in a longitudinal direction on an inner peripheral surface and alternately disposed in a circumferential direction. The conductivity acquisition portion (672) acquires a conductivity between two conductive portions (675). The determination portion (673), on the basis of the conductivity acquired by the conductivity acquisition portion (672), determines the presence or absence of treatment fluid (71) in the inspection pipeline (671), or the type of the treatment fluid (71) in the inspection pipeline (671). The confirmation unit (67) can determine the presence or absence of the treatment fluid (71) or the type of the treatment fluid (71) throughout the length of the inspection pipeline (671), which may be relatively long. It is therefore possible to improve the accuracy of confirmation of the presence or absence of the treatment fluid (71) or the type thereof.

Description

technical field [0001] The present invention relates to a substrate processing apparatus that supplies a processing liquid to a substrate and performs processing. Background technique [0002] Conventionally, in the manufacturing process of a semiconductor substrate (hereinafter, simply referred to as a "substrate"), various processes are performed on the substrate. For example, chemical solution processing such as etching is performed on the surface of the substrate by spraying a chemical solution from a nozzle on a substrate on which a resist pattern is formed. [0003] In the substrate processing apparatus of Japanese Patent No. 5030767 (Document 1), the nozzles for ejecting the processing liquid are connected to the processing liquid supply pipes, and the processing liquid supply pipes are provided with a process for supplying the processing liquid to the nozzles and stopping the supply of the processing liquid to the nozzles. The processing liquid valve for liquid swit...

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Problems solved by technology

Therefore, in the case of using a high-temperature processing liquid higher than the heat-resistant temperature of the sensor (for example, about 70 degrees), there is a possibility that the liquid level sensor cannot be attached to the processing liquid supply pipe.

[0007] In the chemical solution concentration measuring device of Document 2, since a pair of electrodes are inserted into the piping, the flow of the cleaning chemical solution in the piping may be obstructed.

In addition, since it is necessary to provide through-holes on the outer wall of the piping and install electrodes, the structure of the piping and its surroundings is complicated.

Moreover, since the measuring position of the concentration of the chemical solution where the pair of electrodes is installed cannot be easily changed, the concentration of the chemical solution cannot be measured as long as the cleaning chemical solution does not reach the measuring position.

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