Water-resistant epoxy resin used for decoration sheet material
A technology of epoxy resin and decorative boards, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of limited epoxy resin application, poor impact resistance, insufficient toughness, etc., and achieve excellent mechanical properties and durability The effect of good performance and simple preparation method
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Embodiment 1
[0015] A kind of water-resistant epoxy resin that is used for decorative board bonding of the present embodiment, expressed in parts by weight, includes 320-500 parts of bisphenol S type epoxy resin base material, 52-83 parts of dodecenyl succinic anhydride curing agent , 18-32 parts of dimethylformamide, 28-42 parts of filler, 19-27 parts of liquid polysulfide rubber, 17-32 parts of dimethyl methylphosphonate.
[0016] Preparation method of the present invention, concrete steps are:
[0017] (1) First prepare the raw materials for bisphenol S type epoxy resin, take 11-18 parts of sodium hydroxide, 24-39 parts of epichlorohydrin, 16-24 parts of bisphenol S, 19-27 parts of Methyl isobutyl ketone is added to the reaction kettle in a certain proportion, and the catalyst is added, and then stirred in a constant temperature water bath at 42-55°C; then condensed and refluxed for 21 hours;
[0018] (2) After the reaction is completed, add deionized water and mix thoroughly, then let...
Embodiment 2
[0023] A kind of water-resistant epoxy resin used for bonding decorative boards in this embodiment is expressed in parts by weight, 240 parts of the bisphenol S type epoxy resin base material, 39 parts of dodecenyl succinic anhydride curing agent, dimethyl 8 parts of base formamide, 18 parts of filler, 6 parts of liquid polysulfide rubber, 10 parts of dimethyl methylphosphonate.
Embodiment 3
[0025] A kind of water-resistant epoxy resin used for bonding decorative panels in this embodiment is expressed in parts by weight, 310 parts of the bisphenol S type epoxy resin base material, 46 parts of dodecenyl succinic anhydride curing agent, dimethyl 12 parts of base formamide, 24 parts of filler, 12 parts of liquid polysulfide rubber, 14 parts of dimethyl methylphosphonate.
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