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Radio-frequency (rf) shielding in a fan-out wafer level package (fowlp)

A chip-level packaging, fan-out technology, applied in the direction of electrical components, semiconductor devices, electrical solid devices, etc., can solve the problems of limited grounding effect and inability to provide shielding within the module

Active Publication Date: 2017-10-17
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While such conventional ground shielding may be able to provide inter-module shielding, i.e., shielding between separate modules, it cannot provide intra-module shielding, i.e., shielding between different chips within the same module.
Furthermore, the shielding plane of a conventional ground shield is positioned around the outer surface of the molding covering all chips within the module, and is thus separated by a considerable distance from the circuitry embedded within the chip
Therefore, the grounding effectiveness of such conventional grounded shields in conventional FOWLP modules may be limited

Method used

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  • Radio-frequency (rf) shielding in a fan-out wafer level package (fowlp)
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  • Radio-frequency (rf) shielding in a fan-out wafer level package (fowlp)

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Embodiment Construction

[0016] Aspects of the disclosure are described in the following description and associated drawings, referring to specific embodiments. Alternative embodiments may be devised without departing from the scope of the present disclosure. Additionally, well-known elements will not be described in detail or will be omitted so as not to obscure the relevant details of the disclosure.

[0017] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. Similarly, the term "embodiments" does not require that all embodiments include the discussed feature, advantage or mode of operation.

[0018] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include ...

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Abstract

Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a fan-out wafer level package (FOWLP) module or device. Intra-module shielding between individual chips within the FOWLP module or device is achieved by electromagnetic or radio-signal (RF) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips. The conductor shield is directly connected to one or more grounded conductor portions of a FOWLP to ensure reliable grounding.

Description

technical field [0001] Various embodiments described herein relate to integrated circuit packages, and more particularly to fan-out wafer-level packages (FOWLP). Background technique [0002] In conventional integrated circuit modules with fan-out wafer level packages, the ground shielding of the integrated circuit chips is typically provided by a metal shield surrounding the molding covering all chips within the module. While such conventional ground shielding may be able to provide inter-module shielding, ie, shielding between separate modules, it cannot provide intra-module shielding, ie, shielding between different chips within the same module. Furthermore, the shielding plane of a conventional ground shield is positioned around the outer surface of the molding covering all the chips within the module, and is thus separated by a considerable distance from the circuitry embedded within the chip. Therefore, the grounding effectiveness of such conventional ground shields i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L25/065H01L21/56H01L21/60H01L21/48
CPCH01L21/568H01L23/552H01L24/19H01L24/96H01L25/0655H01L2224/04105H01L24/20H01L23/5389H01L23/60H01L23/538H01L24/00
Inventor D·D·金D·F·伯迪M·F·维勒兹C·H·芸左丞杰金钟海M·M·诺瓦克
Owner QUALCOMM INC