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A laser cutting device

A laser and laser technology, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of peeling and ablation of the back coating, excessive heat-affected zone, slag splash pollution, etc., and achieve good cutting effect , high straightness and improved production efficiency

Active Publication Date: 2019-08-23
北京中科镭特电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problems of excessively large heat-affected zone and slag splash pollution in the conventional laser cutting and scribing technology for substrate materials transparent to the laser wavelength, the problem of chipping when splitting, and the problem of peeling and ablation of the back coating, this paper The invention proposes a laser internal cutting device

Method used

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  • A laser cutting device
  • A laser cutting device
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Embodiment Construction

[0042] The present invention is described in detail below in conjunction with accompanying drawing:

[0043] Such as figure 1 As shown, the present invention relates to a laser scribing device, the optical path 2 included in the laser scribing device transmits the laser beam 4 emitted by the laser 1 to the laser precision cutting head 3, and the laser precision cutting head 3 is provided with a diffractive optical Optical lens 5 and focusing lens 6, the laser beam after passing through diffractive optical lens 5 and focusing lens 6 forms focal point 8 respectively on the upper surface and the lower surface of workpiece 7 and the middle part of the thickness direction of workpiece 7; 4. When moving M, the laser acts on the inside and middle of the upper and lower surfaces of the workpiece at the same time; when the speed of the moving M is adjusted so that the focal point has a certain overlapping rate or interval of the spot, a cutting line is formed on the upper, lower surfac...

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Abstract

The invention discloses a laser cutting and dividing device. The device comprises a laser unit, a diffraction optical lens and a focusing mirror, wherein the laser unit is used for emitting a light beam; the laser beam separately forms focusing points on an upper surface, a lower surface and a middle part of a workpiece separately after passing through the diffraction optical lens and the focusing mirror; the focusing points are oval, and extend in the thickness direction of the workpiece; and oval extending length of the focusing point formed on the middle part of the workpiece is greater than that of the focusing points formed on the upper surface and the lower surface of the workpiece.

Description

technical field [0001] The invention belongs to the field of laser cutting and scribing, and relates to a laser cutting and scribing device, which is suitable for laser cutting and scribing of materials that are transparent to the wavelength of the applied laser, the workpiece is relatively thick, and requires no heat-affected zone and no chipping. Background technique [0002] With the progress and development of science and technology, laser has been used as a tool in various industries. Due to the high brightness and high intensity of the laser, and the size of the laser spot can be focused to the micron level by the focusing lens, the laser processing technology is favored in industries with high precision processing requirements, especially for ceramics and single crystal silicon Laser processing technology is particularly popular among scribing technologies that are difficult to process such as high, hard, and brittle sapphire. [0003] Taking the semiconductor indust...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/364B23K26/402B23K26/70
Inventor 不公告发明人
Owner 北京中科镭特电子有限公司