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LED packaging and its manufacturing method

A technology of LED packaging and manufacturing methods, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as failure of deep ultraviolet LEDs, erosion of chips, and impact on light output power and heat transfer of deep ultraviolet LEDs

Active Publication Date: 2019-01-04
EZHOU INST OF IND TECH HUAZHONG UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the application of fluorine-containing polymers with poor adhesive ability in the deep-UV LED sandwich structure (chip-sealant-quartz lens) has great difficulties, and the formed air barrier greatly affects the light output power and Heat transfer causes oxygen and water vapor in the external environment to corrode the chip, resulting in failure of deep ultraviolet LEDs

Method used

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  • LED packaging and its manufacturing method
  • LED packaging and its manufacturing method
  • LED packaging and its manufacturing method

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Embodiment 1

[0029] Such as figure 1 As shown, the present embodiment provides a kind of LED package, comprises substrate 1, chip 2, sealing layer 3, quartz glass 4 successively, and described sealing layer 3 comprises the graphene oxide fluororesin sealant layer 302 of 0.05wt% concentration, 1wt% % KH550 silane coupling agent layer 301, the 0.05wt% graphene oxide fluororesin sealant layer is composed of 2mg / mL graphene oxide dispersion and fluororesin matrix, and the 2mg / mL graphene oxide dispersion The solution is composed of graphene oxide powder and absolute ethanol; the 1wt% KH550 silane coupling agent layer is composed of 5wt% deionized aqueous solution and KH550 silane coupling agent, and the 5wt% deionized aqueous solution is composed of deionized water and anhydrous Ethanol composition.

[0030] Further, the fluororesin matrix is ​​a polymerized perfluoro-4-vinyloxy-1-butene with –CF3 terminal, polymerized from inorganic molecules containing fluorine elements, and has high ultrav...

Embodiment 2

[0044] Such as figure 1 As shown, the present embodiment provides an LED package, which includes a substrate 1, a chip 2, a sealing layer 3, and quartz glass 4 in sequence, and the sealing layer 3 includes a graphene oxide fluororesin sealant layer 302, 1wt% concentration of 0.1wt% %KH550 silane coupling agent layer 301, the 0.1wt% graphene oxide fluororesin sealant layer is composed of 2mg / mL graphene oxide dispersion and fluororesin matrix, the 2mg / mL graphene oxide dispersion The solution is composed of graphene oxide powder and absolute ethanol; the 1wt% KH550 silane coupling agent layer is composed of 5wt% deionized aqueous solution and KH550 silane coupling agent, and the 5wt% deionized aqueous solution is composed of deionized water and anhydrous Ethanol composition.

[0045] Further, the fluororesin matrix is ​​a polymerized perfluoro-4-vinyloxy-1-butene with –CF3 terminal, polymerized from inorganic molecules containing fluorine elements, and has high ultraviolet tra...

Embodiment 3

[0059] Such as figure 1 As shown, the present embodiment provides a kind of LED package, comprises substrate 1, chip 2, sealing layer 3, quartz glass 4 successively, and described sealing layer 3 comprises the graphene oxide fluororesin sealant layer 302 of 0.2wt% concentration, 1wt% %KH550 silane coupling agent layer 301, the 0.2wt% graphene oxide fluororesin sealant layer is composed of 2mg / mL graphene oxide dispersion and fluororesin matrix, the 2mg / mL graphene oxide dispersion The solution is composed of graphene oxide powder and absolute ethanol; the 1wt% KH550 silane coupling agent layer is composed of 5wt% deionized aqueous solution and KH550 silane coupling agent, and the 5wt% deionized aqueous solution is composed of deionized water and anhydrous Ethanol composition.

[0060] Further, the fluororesin matrix is ​​a polymerized perfluoro-4-vinyloxy-1-butene with –CF3 terminal, polymerized from inorganic molecules containing fluorine elements, and has high ultraviolet t...

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Abstract

A LED package includes a substrate, a LED chip, a sealing layer; and a quartz glass in this order. The sealing layer includes a graphene oxide fluororesin sealant layer and a KH550 silane coupling agent layer. The graphene oxide fluororesin sealant layer is composed of a graphene oxide dispersion liquid and a fluororesin matrix. The KH550 silane coupling agent layer is composed of deionized water solution and silane coupling agent. The disclosure further provides a method of manufacturing LED package.

Description

technical field [0001] The invention relates to the field of LED encapsulation, in particular to an LED encapsulation and a manufacturing method thereof. Background technique [0002] Deep ultraviolet LEDs based on AlGaN materials have broad application prospects in the fields of sterilization and disinfection, secure communication, biochemical detection and special lighting, and have received more and more attention and attention in recent years. Currently, thermosetting epoxy resins and organosiloxane resins are widely used as encapsulant materials for LED devices. These encapsulant resins are spotted directly on the die and cure to form a solid encapsulant. However, the organic phase in this conventional Si-O-based encapsulation material is easy to absorb ultraviolet rays, resulting in poor transmittance and easy photolysis failure, making them unsuitable for the field of encapsulation materials for ultraviolet LEDs, especially deep ultraviolet LEDs. Therefore, C–F base...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/56C08L27/12C08K3/04
CPCC08K3/04H01L33/56H01L2933/005C08L27/12H01L33/58H01L2933/0058
Inventor 梁仁瓅许琳琳陈景文王帅张骏杜士达
Owner EZHOU INST OF IND TECH HUAZHONG UNIV OF SCI & TECH
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