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System and method for laser assisted bonding of semiconductor die

A semiconductor and laser technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of connection or device failure, insufficient systems and methods, etc.

Pending Publication Date: 2017-10-27
AMKOR TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Current systems and methods for laser bonding semiconductor die to substrates are deficient, such as potentially producing connection or device failures

Method used

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  • System and method for laser assisted bonding of semiconductor die
  • System and method for laser assisted bonding of semiconductor die
  • System and method for laser assisted bonding of semiconductor die

Examples

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Embodiment Construction

[0021] The following discussion presents various features of the disclosure by providing examples of the disclosure. Such examples are not limiting, and thus the scope of the various features of this disclosure should not be necessarily limited to any particular feature of the examples provided. In the following discussion, the words "for example," "for example," and "exemplary" are not limiting, and are roughly the same as "exemplary and non-limiting," "such as and non-limiting," and the like is synonymous.

[0022] As used herein, "and / or" means any one or more of the items added by "and / or" in the list. For example, "x and / or y" means any element in the set of three elements {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y". As another example, "x, y, and / or z" means the set {(x), (y), (z), (x, y), (x, z), ( y,z), any element in (x,y,z)}. In other words, "x, y and / or z" means "one or more of x, y and z".

[0023] The terminology used herein...

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Abstract

A laser assisted bonding system and a semiconductor device making method are provided. The method comprises the following steps: disposing a semiconductor die on a substrate; transmitting the laser radiation through at least one beam filter, outputting laser radiations from the beam filter while irradiating a first area of the semiconductor die with a first flat top laser beam at a first intensity level; And irradiating a second area of the semiconductor die with a second flat top laser beam at a second intensity level different than the first intensity level. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and / or temporally, to improve bonding of the semiconductor die to a substrate.

Description

technical field [0001] The present invention relates to laser assisted bonding systems and methods of manufacturing semiconductor devices. Background technique [0002] Current systems and methods for laser bonding semiconductor die to substrates have deficiencies, such as the potential for connection or device failure. Further Limitations and Disadvantages of Known and Conventional Approaches To those skilled in the art, comparisons of this approach with the present disclosure as set forth with reference to the drawings in the remainder of this application will become apparent to those skilled in the art. become obvious. Contents of the invention [0003] Various features of this disclosure provide a system and method for laser assisted bonding of semiconductor dies. By way of non-limiting example, various features of this disclosure provide, for example, systems and methods for spatially and / or temporally intensifying or controlling laser exposure of a semiconductor di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67115H01L21/67121H01L21/60H01L23/488H01L23/3128H01L24/81H01L25/0657H01L25/50H01L2224/16145H01L2224/16227H01L2224/73204H01L2224/81815H01L2224/92125H01L2924/15311H01L2924/18161H01L2924/3511H01L2225/06513G02B27/0927H01L24/75H01L2224/81002H01L2224/81007H01L2224/81191H01L2224/81224H01L2224/75263H01L2224/131H01L2924/014H01L24/16G02B27/0093G02B27/0172G02B2027/0138G02B2027/014G06F3/012G06F3/033G09G5/377G09G5/38G09G2320/106G09G2354/00H01L21/4853H01L2021/60112
Inventor 尹泰浩钟梁奎金敏浩宋延锡柳东洙金钟荷
Owner AMKOR TECH INC
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