Photolithographic processing method of micro-nano device

Abstract

The invention discloses a micro / nano device photolithography processing method which comprises the following steps: making a first photolithography mark on a first layer template; attaching the first layer template to a sample of a to-be-processed micro / nano device for performing exposure and development; making a second photolithography mark on the first layer template; matching a segment spacing of the second photolithography mark with a segment of the first photolithography mark, and matching the segment spacing of the first photolithography mark with a segment of the second photolithography mark; attaching a second layer template onto the sample of the to-be-processed micro / nano device, so that the segment of the first photolithography mark is positioned on the segment spacing of the second photolithography mark, and the segment of the second photolithography mark is positioned on the segment spacing of the first photolithography mark; performing exposure and development on the sample of the to-be-processed micro / nano device attached to the second layer template. According to the manner, searching of the photolithography mark is facilitated, and the alignment state of the whole version can be conveniently checked by observation along the segment, so that the photolithography alignment error is reduced.

Description

technical field [0001] The invention relates to the field of manufacturing and processing, in particular to a photolithographic processing method for micro-nano devices. Background technique [0002] Photolithography plays an important role in the field of micro-nano device manufacturing. In the prior art, please refer to figure 1 , during photolithography processing, usually use squares or crosses to make photolithographic marks on the processing template, and then align and align the photolithographic marks on template B with the photolithographic marks on template A, so as to To realize the alignment exposure and development of circuit patterns of different processing templates. [0003] In the prior art, the alignment marks used in lithography often need to be searched for a long time under the microscope of the lithography equipment, which requires strict alignment of the lithography marks on different plate layers. Only after these plate layers are aligned can the v...

AI Technical Summary

Problems solved by technology

Generally speaking, during the alignment process of photolithographic marks, it is judged by naked eyes. When the photolithographic marks have some angular deviations, it is difficult to find, which in turn causes large alignment errors.

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