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Package structure, package method, and display device

A technology of packaging structure and sealing structure, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of low mechanical strength and achieve the effect of enhancing mechanical strength

Inactive Publication Date: 2017-11-28
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problem of low mechanical strength of the packaging structure, the present invention provides a packaging structure, a packaging method, and a display device

Method used

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  • Package structure, package method, and display device
  • Package structure, package method, and display device
  • Package structure, package method, and display device

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Embodiment Construction

[0056] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0057] As an emerging flat panel display device, OLED device has attracted extensive attention. However, components such as water vapor and oxygen in the air can easily enter the OLED device, erode the electrode layer and the organic light-emitting layer in the OLED device, degrade the performance of the OLED device, and seriously affect the service life of the OLED. If the OLED device is sealed in a water-free and oxygen-free environme...

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Abstract

The present invention discloses a package structure, a package method, and a display device, and belongs to the field of display device packaging. The package structure comprises a first substrate and a second substrate disposed opposite to each other, a first sealing structure disposed between the first substrate and the second substrate and located in a peripheral region of the first substrate, a sealing hole arranged in the peripheral region of at least one substrate of the first substrate and the second substrate, and a second sealing structure arranged inside the sealing hole, wherein the first sealing structure is adhered to the second sealing structure. According to the technical scheme of the present invention, the problem of low mechanical strength of the package structure is solved, and the effect of enhancing the mechanical strength of the package structure is achieved; and the technical scheme of the present invention is applied to the display device packaging.

Description

technical field [0001] The invention relates to the field of display device packaging, in particular to a packaging structure, a packaging method, and a display device. Background technique [0002] Organic Light-Emitting Diode (English: Organic Light-Emitting Diode; abbreviation: OLED) display device is an emerging flat-panel display device, which has the advantages of all-solid-state structure, high brightness, full viewing angle, fast response speed and flexible display, and is widely used. in the display industry. The main display device of the OLED display device is an OLED device, and the OLED device is easily eroded by components such as oxygen and water in the air, which seriously affects the service life of the OLED device. Therefore, it is usually necessary to use a packaging structure to package the OLED device to make the OLED The device is isolated from oxygen, water and other components in the air, thereby prolonging the service life of the OLED device. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/50H01L51/52H01L51/56H10K99/00
CPCH10K59/8722H10K59/8723H10K71/40H10K50/8426H10K50/8428H10K71/00H10K71/50
Inventor 蒋志亮
Owner BOE TECH GRP CO LTD