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A semiconductor module

A semiconductor and fluid technology, applied in the field of thermal management, can solve problems such as aging problems of gap filling materials

Inactive Publication Date: 2017-11-28
LAPPEENRANNAN TEKNILLINEN YLIOPISTO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermal conduction from the substrate to the heat sink element can be improved, at least to some extent, by using a gap filling material such as a silicone paste between the substrate and the heat sink element, but aging of the gap filling material can be problematic

Method used

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  • A semiconductor module
  • A semiconductor module
  • A semiconductor module

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Embodiment Construction

[0021] Figure 1a A cross-sectional view of a semiconductor module according to an exemplary and non-limiting embodiment of the present invention is shown. Figure 1b A bottom view of the semiconductor module is shown. Figure 1a The section shown in the Figure 1b obtained from line A-A shown in . The profile is parallel to the xz plane of the coordinate system 190 . Figure 1c shows along the Figure 1b Section taken with line B-B shown in . involve Figure 1c The profile of is parallel to the yz plane of the coordinate system 190 . The semiconductor module comprises a substrate 101, which is advantageously made of a metal comprising eg copper and / or aluminum in order to achieve good thermal conductivity through the substrate. The semiconductor module comprises a cover element 102 which is permanently attached to the substrate such that detaching the cover element from the substrate requires deformation of the material. The semiconductor module includes at least one se...

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Abstract

A semiconductor module comprises a baseplate (101), a cover element (102) attached to the baseplate so that detaching the cover element from the baseplate requires material deformations, and a semiconductor element (103) in a room defined by the baseplate and the cover element. The semiconductor element is in a heat conductive relation with the baseplate and an outer surface (104) of the baseplate is provided with laser machined grooves (105) suitable for conducting heat transfer fluid. The laser machining makes it possible to make the grooves after the semiconductor module has been assembled. Therefore, regular commercially available semiconductor modules can be modified, with the laser machining, to semiconductor modules according to the invention.

Description

technical field [0001] The present disclosure generally relates to thermal management of electrical devices, such as power electronics. More particularly, the present disclosure relates to a semiconductor module suitable for example, but not necessarily a basic building block of an electrical converter. Further, the present disclosure relates to a method for manufacturing a semiconductor module. Background technique [0002] A semiconductor module including a substrate, a cover member, and one or more semiconductor elements can be used as a main circuit part of various electric devices such as, for example, frequency converters, rectifiers, and network inverters. The aforementioned semiconductor element may be, for example, a bipolar junction transistor "BJT", a diode, an insulated gate bipolar transistor "IGBT", a thyristor, a gate turn-off thyristor "GTO", a metal-oxide-semiconductor field-effect transistor "MOSFET" , or any other type of semiconductor component. When a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/473
CPCH01L21/4871H01L23/473H01L2924/0002H01L2924/00H01L23/04H01L23/053H01L23/10
Inventor 米卡·洛坦德尔李维·帕耶宁塔帕尼·西沃安蒂·约尔蒂卡汉努·于利斯乌鲁阿艾玛·帕索伦于尔基·蒙托宁
Owner LAPPEENRANNAN TEKNILLINEN YLIOPISTO