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One-component boiled glue and preparation method thereof
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A one-component, boiled technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc. high viscosity problem
Active Publication Date: 2020-07-07
GUANGZHOU SHUANGKE NEW MATERIAL
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Epoxy AB glue has a high viscosity, which is not conducive to glue application. After the cutting is completed, it takes a long time for the crystal holder to separate from the glass, and the smell is strong
Method used
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Embodiment 1
[0029] In this embodiment, a one-component boiled gelatin comprises the following components in parts by weight:
[0043] The preparation method and construction process of the one-component boiled glue in Example 2 are the same as in Example 1.
Embodiment 3
[0045] In this embodiment, a one-component boiled gelatin comprises the following components in parts by weight:
[0046] 14 parts of triethylene glycol dimethacrylate, 18 parts of tetrahydrofurfuryl acrylate, 18 parts of hydroxyethyl methacrylate, 15 parts of two-functional polyurethane acrylate (Changxing 6148J75), cumene peroxidation 5 parts of hydrogen, 0.7 parts of saccharin, 0.07 parts of p-benzoquinone, 1 part of fumed silica, 16 parts of azodicarbonamide, and 13 parts of urea fat BK.
[0047] The preparation method and construction process of the one-component boiled glue in Example 3 are the same as in Example 1.
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Abstract
The invention relates to single component poached glue and a preparation method thereof. The single component poached glue is prepared from the following components in parts by weight: 12-18 parts of triethylene-glycol dimethacrylate, 16-24 parts of tetrahydrofurfuryl acrylate, 12-18 parts of hydroxyethyl methylacrylate, 12-18 parts of polyurethaneacrylate, 3-5 parts of an initiator, 0.3-0.7 part of an accelerant, 0.03-0.07 part of a polymerization inhibitor, 0.5-1.5 parts of a thixotropic agent, 16-24 parts of azodicarbonamide and 7-13 parts of ureagrease BK. The single component poached glue has good storage stability, and the storage period reaches more than 1 year; the single component poached glue is high in curing efficiency and high in adhesive force, and can be quickly poached to unglue, so that the production efficiency of a siliconwafer can be increased greatly.
Description
technical field [0001] The invention relates to the field of adhesives, in particular to a single-component boiled glue and a preparation method thereof. Background technique [0002] As an important semiconductor material, silicon has good electrical properties and thermal stability. Since it was discovered and utilized by people in the 1960s, it has rapidly replaced single crystalgermanium as the main material of semiconductors. Compared with other semiconductor materials, siliconsingle crystal has the characteristics of high hardness and rich source of raw materials, and has the advantages of easy growth of large-sized high-purity crystals, excellent thermal and mechanical properties, and so on. [0003] Wafercutting is an upstream key technology for the production of silicon wafers (wafers), the main raw material in the electronics industry. The quality and scale of cutting directly affect the subsequent production of the entire industrial chain. In the electronics i...
Claims
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Application Information
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