Oven Controlled Crystal Oscillator Consisting of an Embedded Heated Ceramic Package

Abstract

The invention discloses a constant temperature control crystal oscillator composed of a built-in heating ceramic package, including a substrate, a crystal package, a crystal sheet, a metal cover, a first integrated circuit chip and a cover. The crystal package is arranged on the substrate, the central bottom of the crystal package is provided with a first integrated circuit chip, and the crystal sheet is arranged in the crystal package and sealed by a metal cover. The crystal package has an embedded heating layer, which establishes a symmetrical thermal field relative to the first integrated circuit chip and the crystal plate. Alternatively, an embedded heating ceramic carrier substrate is located between the first integrated circuit chip and the crystal plate to establish a symmetrical thermal field relative to the first integrated circuit chip and the crystal plate. The cover is combined with the substrate to cover the crystal package and the metal cover.

Description

technical field [0001] The present invention relates to a crystal oscillator, and in particular to an oven-controlled crystal oscillator composed of an embedded heating ceramic package, wherein the embedded heating ceramic package establishes a symmetrical thermal field to achieve good thermal uniformity . Background technique [0002] like figure 1 As shown, the main part of the oven controlled crystal oscillator is the ceramic carrier substrate 10, which is located in the central area of ​​the entire oven. Above and below the ceramic carrier substrate 10 are a simple crystal package 12 and an integrated circuit chip 14, respectively. The integrated circuit chip 14 includes a heater 16, a temperature sensor 18, an oscillation circuit and a temperature control circuit. The integrated circuit chip 14 is coated with an overcoating filling 15 . The crystal chip 20 is disposed in the cavity of the simple crystal package 12 and sealed with a metal cover 22 . After the crysta...

AI Technical Summary

Problems solved by technology

This structure belongs to the asymmetric thermal field relative to the heater 16, so there is an obvious temperature gradient difference between the crystal plate 20 and the integrated circuit chip 14, in other words, the thermal field symmetry of this structure is not good, and the temperature uniformity is not good enough , which will affect the effect of controlling the temperature uniformity of the constant temperature bath

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