A module with soldering ends at the bottom

Abstract

The invention provides a module with soldering ends at the bottom. The module comprises a module body, a plurality of soldering ends arranged at the lower surface of the module body, and a solder mask around the multiple soldering ends; the soldering ends are provided with bosses; the height of the soldering ends with the bosses is greater than that of the solder mask. The soldering ends of the module are provided with the bosses and are thus heightened, so that the contact gaps between the soldering ends with the bosses and a bonding pad of an interface plate are reduced and insufficient solder caused by warping of modules is solved; the height of the soldering ends with the bosses is greater than that of the solder mask, so that the gap between the solder mask at the lower surface of the module body and the interface plate is expanded, volatilization of soldering flux in a reflow soldering process of the module is facilitated and the problems are solved that solder paste cannot pull a bonding pad back in reflow soldering and causes solder balls and short bridges because an extrusion gap for solder resisting between a module and an interface plate is too small.

Description

technical field [0001] The invention relates to microelectronic technology, in particular to a module with soldering ends at the bottom. Background technique [0002] With the rapid development of microelectronic technology, more and more printed circuit boards (Printed Circuit Board, PCB board) are also used. There are more and more modular solutions for PCB products, and the modules have better portability, which can not only save a lot of product development time, but also save product development costs. At present, the mainstream module packages are LCC (Leadless Chip Carriers) and LGA (Land Grid Array). The secondary assembly methods of modules also include connectors, welding, and crimping. [0003] At present, in the LGA module that is assembled by soldering, the bottom soldering end of the LGA module is designed, and the non-soldering end position at the bottom of the LGA module is used for wiring and solder mask, or the non-soldering end position is solder masked. ...

AI Technical Summary

Problems solved by technology

When LGA modules are used, it is necessary to conduct a warpage test on the warped LGA modules and select them; therefore, additional processes and costs are added, and rework is difficult; even if the related costs are increased, the problem of virtual soldering cannot be completely solved

[0006] When the weight of the LGA module is heavy or the center of gravity of the module itself is evenly distributed, the solder paste printed on the interface board will be crushed and collapsed at the heavier part of the LGA module itself during soldering, and the solder paste will be squeezed out of the pad of the interface board. Therefore, the LGA module When soldering on the interface board, it is easy to cause the LGA module to be soldered with tin

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