Thermal design layout method for modular active filtering apparatus

Abstract

The invention relates to a thermal design layout method for a modular active filtering apparatus. The thermal design layout method comprises a structural design, an air duct design, a component layout, a fan layout, a radiator design and a vent hole design. The structural design includes a shell design and an internal functional unit design. According to the air duct design, the internal space of a module is divided into an upper cavity and a lower cavity by an air deflector to form two independent straight air ducts. On the basis of the component layout, a low-temperature low-interference-prevention unit is arranged in the upper cavity and a high-temperature high-heat unit is arranged in the lower cavity. On the basis of the fan layout, with a fan-parallel mode, a fan is arranged at an air outlet by means of ventilation at the upper cavity and a fan is arranged at an air inlet by means of air flowing at the lower cavity. According to the radiator design, an aluminum radiator formed by an aluminum extrusion technology is employed. And according to the vent hole design, an air duct inlet hole of the upper cavity is arranged beside a core device needing strict temperature control. Compared with the prior art, the thermal design layout method has advantages of high safety and reliability, high power, small size, and great convenience in production and the like.

Description

technical field [0001] The invention relates to the heat dissipation technology of an active filter device, in particular to a thermal design and layout method of a modular active filter device. Background technique [0002] At present, many active filtering devices on the market have turned to a "modular" structure. Although this structure has many advantages, such as small size (about the size of a 24-inch suitcase), light weight, convenient production, low cost, and convenient expansion, etc., core components (IGBT, MOSFET, rectifier, and switch tube drivers) frequently appear. , filter inductance) failure, explosion, burning and other relatively severe situations. For heating devices, under the premise of the same power loss, that is, the same calorific value per unit time, the smaller the heat dissipation area, the higher the heat flux density, the smaller the device volume, the smaller the heat radiation range, and the higher the heat conduction efficiency. lower. I...

AI Technical Summary

Problems solved by technology

If such heating components do not effectively exchange heat with the air, the internal temperature of the entire device will be too high. When the operating temperature limit of some components is reached, the above components will fail, explode, burn, etc.

Therefore, thermal design is particularly important when active filter devices are designed in a modular manner. No thermal design or immature thermal design has become the biggest obstacle to the safe and stable operation of many modular active filter devices on the market.

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