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Method and device for detaching a substrate from a substrate stack

A substrate and carrier substrate technology, which is applied in the direction of adhesive heating, bonding methods, chemical instruments and methods, etc., can solve the problems of delay, slow separation process, pollution of separation pools, etc. The effect of combined strength

Inactive Publication Date: 2018-01-09
EV GRP E THALLNER GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, the continued separation of the binder contaminates the separation cell, which leads to a slow but constant delay in the separation process
This problem is solved, for example, by a continuous inflow and outflow of solvent, but this leads to an increased consumption of solvent

Method used

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  • Method and device for detaching a substrate from a substrate stack
  • Method and device for detaching a substrate from a substrate stack
  • Method and device for detaching a substrate from a substrate stack

Examples

Experimental program
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Embodiment Construction

[0131] figure 1 Shown is a substrate stack designed as a wafer stack 1 bonded over its entire surface, which consists of a carrier substrate 3 , a connection layer 4 designed as an adhesive layer, and a product substrate 5 . The two substrates 3 , 5 have the same diameter D in the exemplary embodiment shown. The substrate surfaces 3 o , 5 o of the carrier substrate 3 and of the product substrate 5 are covered at least substantially, preferably entirely, with respect to the parallel opposing surfaces by the connecting layer 4 .

[0132] figure 2 Shown is a substrate stack configured as a ZoneBOND® bonded wafer stack 2, which consists of a carrier substrate 3, product Substrate 5 and connection layer 4'.

[0133] The low-adhesion layer 6 is applied centrally within the central circular surface 13 with a diameter A smaller than the diameter D onto the carrier substrate 3 . The peripheral edge region 12 thus formed is in particular a circular ring with an in particular circum...

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Abstract

The invention relates to a method for detaching a carrier substrate (3) from a substrate stack (1, 2), which is formed by the carrier substrate (3) and a product substrate (5) and a connecting layer (4, 4') connecting the carrier substrate (3) and the product substrate (5), wherein the connecting layer (4, 4') has an adhesion strength for connecting the carrier substrate (3) and the product substrate (5) and the adhesion strength is at least partially reduced by means of a beam (8, 8') of electromagnetic radiation directed at least predominantly at the connecting layer (4, 4'). The invention further relates to a corresponding device.

Description

technical field [0001] The invention relates to a method according to claim 1 and a device according to claim 9 . Background technique [0002] The industry uses so-called temporary bonding methods in order to temporarily connect two substrates, in particular two wafers, to each other. In most cases, one of these two substrates is the carrier substrate. The second substrate is the product substrate. The functional units (such as microchips, MEMs, LEDs, etc.) are fabricated on the product substrate. Very often, the product substrate has to be thinned back in a further process step. A thinning-back process is understood to be a process in which the thickness of a substrate is significantly reduced, ie to approximately 50 μm, by means of different process technologies, in particular mechanical polishing. Stabilization usually takes place via a carrier substrate. [0003] Different methods exist in the industry for temporarily fixing two substrates. One of the most importa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683C09J5/00
CPCC09J5/00C09J2301/416C09J2301/502H01L21/6835H01L2221/68318H01L2221/68381C09J2203/326B32B43/006B32B2310/0806C09J5/06C09J2483/00H01L21/67132H01L21/6836
Inventor J.布格拉夫
Owner EV GRP E THALLNER GMBH