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Preparation method and application of high-strength bonding copper wire

A bonding copper wire, high-strength technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as hardening, and achieve the effect of simple process, strong practicability, and improved mechanical strength

Inactive Publication Date: 2018-01-19
佛山慧创正元新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High-purity niobium metal is highly ductile but hardens with increasing impurity content

Method used

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  • Preparation method and application of high-strength bonding copper wire

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) the purified copper obtained by electrolytic purification with a purity of 99.999wt% is obtained through metal single crystal horizontal continuous casting to obtain a single crystal copper with a purity of 99.9999wt%;

[0027] (2) Vacuum the melting furnace until the vacuum degree reaches 10 -1 Pa, fill in nitrogen to make the pressure in the furnace reach 0.7MPa, heat and melt single crystal copper, then add 5wt% niobium, 4.7wt% chromium, 1.8wt% titanium diboride powder, 0.5wt% O-cresol novolac epoxy resin, continue heating to 3200°C, stir evenly to obtain mixed copper liquid;

[0028] (3) the mixed copper liquid that step (2) is obtained is transferred in the holding furnace after cooling and filtering, and the surface of the mixed copper liquid in the holding furnace is covered with a cover layer that is made up of charcoal and graphite flakes, and the temperature of the holding furnace is 1400°C, the mold of the continuous casting machine is inserted into the ...

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PUM

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Abstract

The invention discloses a preparation method and an application of a high-strength bonding copper wire. The preparation method of the high-strength bonding copper wire comprises the following steps: purifying electrolytic copper, and performing horizontal continuous casting on metal single crystals to prepare single crystal copper, then smelting the single crystal copper, adding a certain amount of niobium, chromium and titanium diboride powder and o-cresol formaldehyde epoxy resin to obtain mixed copper liquid, coagulating and towing the mixed copper liquid in a holding furnace to form an oxygen-free copper rod, finally performing wire drawing and annealing, and spraying a protective film coating solution to obtain a finished product. The high-strength bonding copper wire prepared by themethod has excellent mechanical strength, the cost is low, and the industrial requirements can be satisfied, so that the application prospect is good. Meanwhile, the invention further discloses an application of the high-strength bonding copper wire prepared by the method in integrated circuits.

Description

technical field [0001] The invention relates to the technical field of metal material processing, in particular to a preparation method and application of high-strength bonding copper wire. Background technique [0002] As a product family, bonding wire is one of the key materials for semiconductor packaging. Its function is to realize the electrical connection between the semiconductor chip and the pins, and to play the role of introducing and exporting current between the chip and the outside world. Bonding copper wire is gradually adopted in microelectronic packaging due to its excellent mechanical properties, electrical properties and low cost factors. The existing bonding copper wire uses high-purity single crystal copper as raw material, and single crystal copper bonding wire is used in During the drawing process, due to the uneven force of the drawing, the copper grains are broken during the drawing process, forming irregular semi-continuous columnar grains. After hea...

Claims

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Application Information

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IPC IPC(8): H01L21/48C22C9/00C22C1/10C22C1/02
Inventor 邵光伟
Owner 佛山慧创正元新材料科技有限公司