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Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuit, etc., can solve the problems of reduced reliability of circuit boards, achieve the effect of improving reliability and avoiding the formation of pores

Active Publication Date: 2018-01-19
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, a considerable number of voids are generated in the formed circuit board, thereby causing a problem that the reliability of the circuit board is reduced

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0032] Figure 1A to Figure 1D It is a schematic cross-sectional view showing the manufacturing process of the circuit board according to the first embodiment of the present invention. First, please refer to Figure 1A , forming a circuit pattern 102 on the dielectric substrate 100 . The circuit pattern 102 exposes a portion of the dielectric substrate 100 . The circuit pattern 102 is formed by, for example, forming a conductive material layer on the dielectric substrate 100 by pressing and patterning the conductive material layer. The material of the dielectric substrate 100 is, for example, epoxy resin, glass fiber cloth or ceramics. In this embodiment, the thickness of the circuit pattern 102 is greater than 100 μm. When the thickness of the circuit pattern 102 is greater than 100 μm, the formed circuit board may be suitable for a vehicle device requiring a large amount of current, but the present invention is not limited thereto.

[0033] In addition, please refer to ...

no. 2 example

[0039] Figure 3A to Figure 3C It is a schematic cross-sectional view showing the manufacturing process of the circuit board according to the second embodiment of the present invention. In this embodiment, the same components and steps as those in the first embodiment will not be further described. First, please refer to Figure 3A , before placing the dielectric layer 104 on the dielectric substrate 100 , the dielectric layer 104 is selectively exposed using a mask 110 . When the light 112 passes through the mask 110 and irradiates the dielectric layer 104, as Figure 1C As described, a portion 108 a having a higher glass transition temperature and a portion 108 b maintaining the original glass transition temperature are formed in the photosensitive network fiber 108 . Since the mask 100 has openings corresponding to the positions of the circuit patterns 102 , the formed portion 108 a having a higher glass transition temperature will correspond to the positions of the circ...

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Abstract

The invention provides a circuit board and a manufacturing method thereof. The circuit board includes a dielectric substrate, a circuit pattern, and a dielectric layer. A circuit pattern is disposed on the dielectric substrate. The dielectric layer is disposed on the dielectric substrate and covers the circuit pattern. The dielectric layer includes a dielectric matrix and a reticular fiber structure disposed in the dielectric matrix. The part over the dielectric substrate exposed by the circuit pattern does not have the reticular fibrous structure. The method can make circuit boards with highreliability.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board without a net-like fiber structure in a dielectric layer above a portion of a dielectric substrate exposed by a circuit pattern and a manufacturing method thereof. Background technique [0002] In general, the circuit board process includes forming a circuit pattern on a substrate, forming a dielectric layer covering the circuit pattern, forming a conductive via in the dielectric layer, forming another circuit pattern on the dielectric layer, etc. step. The above-mentioned dielectric layer is generally composed of a resin matrix and a network glass fiber structure located in the resin matrix. For the step of forming the dielectric layer covering the circuit pattern, the dielectric layer is usually placed on the substrate on which the circuit pattern has been formed, and then the resin matrix of the dielectric layer is melted to cover the circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/00
Inventor 陈盈儒张启民余丞博
Owner UNIMICRON TECH CORP