Wafer annealing device

An annealing device and wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reducing the service life of heating bulbs, heating bulbs damage, etc., to improve production rhythm, reduce the probability of damage, improve The effect of the service life

Inactive Publication Date: 2018-01-26
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] During the annealing process, the temperature of the wafer needs to be changed within a large temperature range, so the temperature emitted by the heating bulb needs to be changed with

Method used

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Example

[0031] First embodiment

[0032] Reference figure 1 , figure 2 , A wafer annealing device, including a transfer platform M, a preheating chamber A, a process chamber B and a cooling chamber C ( figure 2 The preheating chamber A and the process chamber B are not shown in the figure. The preheating chamber A, the process chamber B and the cooling chamber C are fixedly arranged on the transfer platform M along the circumferential direction of the transfer platform M. Among them, the wafer annealing device includes three preheating chambers A, three process chambers B, and two cooling chambers C, which are preheating chamber A1, preheating chamber A2, preheating chamber A3, and process Chamber B1, process chamber B2, process chamber B3 and cooling chamber C1, cooling chamber C2.

[0033] The wafer annealing device also includes three wafer storage chambers D and two transfer mechanisms, namely wafer storage chamber D1, wafer storage chamber D2, wafer storage chamber D3, first transfe...

Example

[0062] Second embodiment

[0063] Reference Figure 5 The difference between this embodiment and the first embodiment is that the wafer annealing device includes four preheating chambers A and two process chambers B, which are preheating chamber A1, preheating chamber A2, and preheating chamber A2. Thermal chamber A3, preheat chamber A4, process chamber B1, and process chamber B2.

[0064] Among them, the preheating chamber A1 and the preheating chamber A3 correspond to the process chamber B1, and the process of transferring the wafer by the first transfer mechanism J1 is: cooling chamber C, preheating chamber A1 or preheating chamber A3, Process chamber B1, and finally return to cooling chamber C.

[0065] The preheating chamber A2 and the preheating chamber A4 correspond to the process chamber B2. The process of transferring the wafer by the first transfer mechanism J1 is as follows: cooling chamber C, preheating chamber A2 or preheating chamber A4, process chamber B2, and finall...

Example

[0081] The third embodiment

[0082] Reference Image 6 The difference between this embodiment and the first embodiment is that the wafer annealing device includes two preheating chambers A and four process chambers B, which are preheating chamber A1, preheating chamber A2, and Chamber B1, process chamber B2, process chamber B3, and process chamber B4.

[0083] Among them, the preheating chamber A1 corresponds to the process chamber B1 and the process chamber B3. The process of transferring the wafer by the first transfer mechanism J1 is: cooling chamber C, preheating chamber A1, process chamber B1 or process chamber Room B3, and finally return to cooling chamber C.

[0084] The preheating chamber A2 corresponds to the process chamber B2 and the process chamber B4. The process of transferring the wafer by the first transfer mechanism J1 is as follows: cooling chamber C, preheating chamber A2, process chamber B2 or process chamber B4, and finally back to cooling chamber C.

[0085] R...

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Abstract

The invention relates to a wafer annealing device. The wafer annealing device comprises a pre-heating chamber, a process chamber, a conveying platform, and a first conveying mechanism, wherein the pre-heating chamber and the process chamber are circumferentially arranged at the conveying platform, and the first conveying mechanism is fixedly arranged on the conveying platform and is used for conveying wafers from the pre-heating chamber to the process chamber. The wafer annealing device is advantaged in that the pre-heated wafers have relatively high temperature, when the pre-heated wafers having the relatively high temperature are heated in the process chamber, the temperature change scope of the wafers in the process chamber is relatively small, the temperature change scope of a heatingbulb in the process chamber is made to be relatively small, burning probability of the heating bulb is reduced, and service life of the heating bulb is improved.

Description

Technical field [0001] The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer annealing device. Background technique [0002] Ion implantation can cause damage to the surface of the wafer, causing silicon atoms to leave the position of the crystal lattice, causing disorder in the crystal lattice. Therefore, it is necessary to use a rapid high temperature annealing process (Rapid thermal Process, RTP) to repair the ion implanted wafer. [0003] In the prior art, an annealing device is generally used to perform a rapid high temperature annealing process on the wafer. Specifically, the annealing device has a process chamber, and a heating bulb is arranged in the process chamber. During the annealing process, the wafer is set in the process chamber, and the heating bulb emits light to illuminate the wafer to heat the wafer; by controlling the power of the heating bulb, the temperature emitted by the heating bulb can be changed ...

Claims

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Application Information

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IPC IPC(8): H01L21/67
Inventor 周颖吴宗祐林宗贤
Owner HUAIAN IMAGING DEVICE MFGR CORP
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