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Polyimide-based composite film and preparation method thereof

A polyimide-based, polyimide-based technology, applied in the field of polyimide-based composite film and its preparation, can solve the problems of low transmittance, affecting the stability of electronic components, and high thermal expansion coefficient

Inactive Publication Date: 2018-02-16
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary polyimide films are usually brown or brownish-yellow, have low transmittance in the visible light region, and have a high thermal expansion coefficient, which affects the stability of electronic components.

Method used

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  • Polyimide-based composite film and preparation method thereof

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Experimental program
Comparison scheme
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Embodiment 1

[0050] A preparation method of a polyimide-based composite film, comprising the steps of:

[0051] ①. Take 4 parts by weight of nano-silica (particle size is 30nm), 1 part of dispersant (specifically ethyl acetate), 2 parts of binder (specifically hydroxypropyl methylcellulose), organic 80 parts of solvent (specifically N-methyl-2-pyrrolidone), stirred evenly to make a slurry;

[0052] ②. At room temperature, weigh pyromellitic dianhydride and p-phenylenediamine in a molar ratio of 1:1, the total weight is 90 parts, and add it to the slurry prepared in step 1), in a nitrogen atmosphere , carry out sufficient low-temperature polycondensation reaction at 30°C for 6 hours to obtain a reaction slurry;

[0053] ③. In a nitrogen atmosphere, evenly coat the reaction slurry on a clean and smooth glass substrate, control the coating thickness to 40 μm, and bake at 120°C for 20 minutes to form a film;

[0054] ④. In a nitrogen atmosphere, heat the film in step ③ from 150°C to 450°C at...

Embodiment 2

[0058] A preparation method of a polyimide-based composite film, comprising the steps of:

[0059] ①. Take 6 parts by weight of nano-silicon nitride (particle size is 40nm), 1.5 parts of dispersant (specifically, alkylphenol polyoxyethylene ether), 3 parts of binder (specifically, butadienyl triethyl Oxysilane), 120 parts of organic solvent (specifically N,N-dimethylformamide), stirred evenly to make a slurry;

[0060] ②. At room temperature, weigh pyromellitic dianhydride and m-phenylenediamine in a molar ratio of 1:1, the total weight is 135 parts, and add it to the slurry prepared in step 1), in a nitrogen atmosphere , fully carry out the low-temperature polycondensation reaction at 35°C for 3 hours, and obtain the reaction slurry;

[0061] ③. In a nitrogen atmosphere, evenly coat the reaction slurry on a clean and smooth glass substrate, control the coating thickness to 30 μm, and bake at 130°C for 10 minutes to form a film;

[0062] ④. In a nitrogen atmosphere, heat the...

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Abstract

The invention provides a polyimide-based composite film and a preparation method. An inorganic material is introduced into a reaction system of an aromatic dianhydride monomer and an aromatic diaminemonomer, a modified polyamic acid solution is obtained through low-temperature polymerization, and finally the polyimide-based composite film is obtained through imidization. The composite film showsexcellent high temperature resistance, low expansion coefficient and excellent mechanical properties, and can be applied to the technical field of flexible display.

Description

technical field [0001] The invention relates to the field of flexible display technology, in particular to a polyimide-based composite film and a preparation method thereof. Background technique [0002] Polyimide (polyimide, PI) is a polymer compound containing an imide ring structure in the main chain of the molecule. It has excellent heat resistance, chemical resistance, electrical insulation, mechanical properties and other properties, and can be widely used In the fields of navigation and aerospace, electrical insulation, microelectronics and so on. In recent years, polyimide has begun to be used in the field of flexible displays. However, in the field of display technology, the material used as a flexible film substrate needs to have a low thermal expansion coefficient and high thermal conductivity. Ordinary polyimide films are usually brown or brownish-yellow, have low transmittance in the visible light region, and have a high thermal expansion coefficient, which af...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08K3/36C08K3/34C08G73/10
CPCC08G73/1067C08J5/18C08J2379/08C08K3/34C08K3/36C08K2201/003C08K2201/011
Inventor 柯霖波
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD