Phase taking device

Abstract

The invention relates to a phase-taking device, which is used to obtain an image of a target object. The phase-taking device includes a base, and a window through which light beams can pass is arranged in the middle; a first optical assembly and a second optical assembly, and a first optical assembly and a second optical assembly. The two optical components are arranged on the base and are respectively located on both sides of the window; the first image module is used to receive the first image transmitted by the first optical component; and the second image module is used to receive the first image transmitted by the second optical module. The second image transmitted by the component; wherein, the first image and the second image are partial or full images of the target object. The imaging device provided by the present invention can respectively transmit the imaging of the target object to the first image module and the second image module through the first optical assembly and the second optical assembly on both sides of the window, so that the image acquisition device does not need to move The image module can obtain a larger field of view, thereby avoiding the influence of the error generated when the image module moves and recognizes on the phase acquisition accuracy, thereby improving the phase acquisition accuracy and efficiency of the phase acquisition device.

Description

technical field [0001] The invention belongs to the field of laser auxiliary equipment, in particular to a phase acquisition device. Background technique [0002] In technical fields such as alignment and lamination, fast grabbing, laser cutting and laser marking, it is necessary to use an optical imaging device to capture images of the target object. Especially in the fields of high-precision laser cutting and laser marking, the position of the target object obtained by the phase acquisition device directly affects the cutting or marking accuracy, which in turn affects the product quality. [0003] However, the current imaging device is prone to errors when capturing the image of the target, resulting in low cutting or marking accuracy; and when capturing the phase of a larger target, it usually needs to move and scan above the target. It is easy for the phase acquisition device to move, and it takes a lot of time to scan the target, which affects work efficiency. Conten...

AI Technical Summary

Problems solved by technology

Especially in the fields of high-precision laser cutting and laser marking, the position of the target obtained by the phase acquisition device directly affects the cutting or marking accuracy, which in turn affects the product quality

[0003] However, the current imaging device is prone to errors when capturing the image of the target, resulting in low cutting or marking accuracy; and when capturing the phase of a larger target, it usually needs to move and scan above the target. It is easy for the phase acquisition device to move, and it takes a lot of time to scan the target, which affects work efficiency

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