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Preparation method of prepreg for high-toughness halogen-free CEM-3 copper clad laminates

A prepreg technology with high toughness, applied in chemical instruments and methods, applications, household appliances, etc., can solve the problems of non-environmental protection and low toughness, and achieve the effects of low defect rate, low cost, and good thickness uniformity

Active Publication Date: 2018-03-13
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a high toughness halogen-free CEM-3 copper clad laminate glue, prepreg and copper clad laminate and its preparation method

Method used

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  • Preparation method of prepreg for high-toughness halogen-free CEM-3 copper clad laminates
  • Preparation method of prepreg for high-toughness halogen-free CEM-3 copper clad laminates
  • Preparation method of prepreg for high-toughness halogen-free CEM-3 copper clad laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] 1. A preparation method of glue for high-toughness halogen-free CEM-3 copper-clad laminates:

[0046] Raw material formula:

[0047] Resin: 100 parts of phenolic epoxy resin, 400 parts of flame-retardant modified liquid halogen-free epoxy resin, 200 parts of flame-retardant modified solid halogen-free epoxy resin; the modified epoxy resin here is DOPO type halogen-free flame-retardant ring Oxygen resin, product name: DOPO type, epoxy value: 8.3-9.4 (Eq / kg), viscosity at 27°C (mPa s): 2000-5000; the flame-retardant modified solid epoxy resin here is DOPO type halogen-free Flame retardant epoxy resin, product name: DOPO type, epoxy value: 970-1070 (g / eg), viscosity 150°C (mPa s): 8000-11000;

[0048] Curing agent: 40 parts of dicyandiamide (DICY);

[0049] Curing accelerator: 0.20 parts of 2-phenylimidazole (C-2 substitution);

[0050] Solvent: 150 parts of organic solvent (acetone: butanone: DMF: propylene glycol methyl ether = 1:1:6:1).

[0051] Preparation method: ...

Embodiment 2

[0062] 1. A preparation method of glue for high-toughness halogen-free CEM-3 copper-clad laminates:

[0063] Raw material formula:

[0064] Resin: 80 parts of phenolic epoxy resin, 300 parts of flame-retardant modified liquid halogen-free epoxy resin, 150 parts of flame-retardant modified solid halogen-free epoxy resin; the flame-retardant modified epoxy resin here is DOPO type halogen-free epoxy resin Combustible epoxy resin, product name: DOPO type, epoxy value: 8.3-9.4 (Eq / kg), viscosity at 27°C (mPa s): 2000-5000; the flame-retardant modified solid epoxy resin here is DOPO type Halogen-free flame retardant epoxy resin, product name: DOPO type, epoxy value: 970-1070 (g / eg), viscosity 150°C (mPa s): 8000-11000;

[0065] Curing agent: 30 parts of dicyandiamide (DICY);

[0066] Curing accelerator: 0.20 parts of 2-phenylimidazole (C-2 substitution);

[0067] Solvent: 120 parts of organic solvent (acetone: butanone: dimethylformamide: propylene glycol methyl ether = 1:1:6:1)....

Embodiment 3

[0078] 1. A preparation method of glue for high-toughness halogen-free CEM-3 copper-clad laminates:

[0079] Raw material formula:

[0080] Resin: 120 parts of phenolic epoxy resin, 450 parts of flame-retardant modified liquid halogen-free epoxy resin, 250 parts of flame-retardant modified solid halogen-free epoxy resin; the flame-retardant modified epoxy resin here is DOPO type halogen-free epoxy resin Combustible epoxy resin, product name: DOPO type, epoxy value: 8.3-9.4 (Eq / kg), viscosity at 27°C (mPa s): 2000-5000; the flame-retardant modified solid epoxy resin here is DOPO type Halogen-free flame retardant epoxy resin, product name: DOPO type, epoxy value: 970-1070 (g / eg), viscosity 150°C (mPa s): 8000-11000;

[0081] Curing agent: 50 parts of dicyandiamide (DICY);

[0082] Curing accelerator: 0.30 parts of 2-phenylimidazole (C-2 substitution);

[0083] Solvent: 200 parts of organic solvent (acetone: butanone: dimethylformamide: propylene glycol methyl ether = 1:1:6:1)...

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Abstract

The invention discloses a preparation method of a prepreg for high-toughness halogen-free CEM-3 copper clad laminates. The preparation method comprises: coating an electronic-grade glass fiber cloth with a high-toughness halogen-free CEM-3 copper clad laminate glue liquid, and baking to obtain a veneering prepreg; and coating a glass felt with a high-toughness halogen-free CEM-3 copper clad laminate glue liquid, and baking to obtain a sandwich prepreg, wherein the raw materials of the high-toughness halogen-free CEM-3 clad laminate glue liquid comprise, by weight, 75-120 parts of a phenol formaldehyde epoxy resin, 300-450 parts of a flame retardant modified liquid-state non-halogen epoxy resin, 150-250 parts of a flame retardant modified solid-state non-halogen epoxy resin, 25-50 parts ofa curing agent, 0.10-0.30 parts of a curing accelerator, and 100-200 parts of an organic solvent. According to the present invention, the prepreg prepared through the preparation method has advantagesof good heat resistance and good chemical resistance, and can reduce the environmental pollution.

Description

technical field [0001] The invention specifically relates to a preparation method of a prepreg for a high-toughness halogen-free CEM-3 copper-clad laminate. Background technique [0002] Copper Clad Laminate (CCL) is the main material for the manufacture of printed circuit boards (PCB), so it is also an indispensable basic electronic material for the complete machine and components of any electronic product. With the rapid development of the PCB industry, the market demand for high-performance copper clad laminates is increasing day by day. In the era of green environmental protection, it has developed in an all-round way and is becoming more and more mature. In addition to the heat resistance, TG value, and CTE value of the product, it has attracted much attention. In addition, the toughness, PCB processability, and adhesion of materials have also become a focus of everyone's attention. The balanced development of the performance of the CCL base material has become an impor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/14B32B17/02B32B17/06B32B17/12B32B15/20B32B33/00B32B37/06B32B37/10
CPCC08L63/00B32B5/02B32B5/26B32B15/14B32B15/20B32B33/00B32B37/06B32B37/10C08L2205/03C08L2205/025C08L2201/08B32B2457/08B32B2250/40B32B2255/02B32B2255/26B32B2262/101B32B2309/02B32B2309/12B32B2309/04B32B2307/306B32B2307/558C08K7/14
Inventor 李清亮吴兰中李子龙
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD