Board-level assembly device

Abstract

The embodiment of the invention relates to the technical field of electronics and discloses a board-level assembly device. The board-level assembly device comprises a circuit board, a package device,a first piezoelectric thin sheet and a second piezoelectric thin sheet, wherein the package device is welded on the circuit board, the first piezoelectric thin sheet is arranged between the package device and the circuit board, the second piezoelectric thin sheet is arranged on a surface of the circuit board, the first piezoelectric thin sheet is electrically connected with the second piezoelectric thin sheet, and the second piezoelectric thin sheet is used for driving the first piezoelectric thin sheet to generate deformation for offsetting vibration according to a voltage generated during vibration. By the board-level assembly device, the influence of the vibration of the circuit board on the package device is reduced during vibration of the circuit board and the reliability of the board-level assembly device under a vibration environment is improved.

Description

technical field [0001] Embodiments of the present invention relate to the field of electronic technology, and in particular to a board-level assembly device. Background technique [0002] Microelectronic packaging devices are generally mounted on the outer surface of the circuit board through surface assembly technology. The connection between the device and the circuit board is usually in the form of a ball grid array (BGA) or pins, and the electrical and mechanical connections are realized by soldering. When the board-level assembly device is subjected to strong periodic vibration or random vibration load during use, it is easy to damage the connection position of BGA, pins and circuit board, resulting in device failure. On the other hand, strong vibration will also affect the performance of the device. [0003] Aiming at the problems caused by the impact of vibration on devices, people currently use various methods to minimize the impact of vibration, such as: filling gl...

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Problems solved by technology

[0004] The inventors have found that there are at least the following problems in the prior art: the way of filling glue, the underfill glue is a poor conductor, which is not good for the heat dissipation of active devices, and the thermal expansion rate of the underfill glue is larger than that of the device, so it may cause additional damage during the high temperature process. thermal stress; in some harsh environments, such as applications with high temperature and long time, the rubber aging problem occurs and the vibration protection effect is lost

Using a spring or elastic connection between the device and the circuit board will increase the assembly volume of the device, which is not conducive to the application of high-density assembly, and after a long period of use, the elastic body will lose its protective effect

The way of adding the damping device will make the structure very complicated, and the cost is very high, which is not conducive to the application in microelectronic devices, so the scope of application is not wide

The method of adding energy-absorbing structures or vibration-isolation pads to the fixed position of the circuit board is used. The energy-absorbing structure is more complicated, and the simple vibration-isolation pads cannot fully meet the requirements of some devices for reducing vibration.

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