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Nondestructive testing method for ultra-precision machining sub-surface damage of optical crystal

A technology of subsurface damage and ultra-precision machining, which is used in material analysis using radiation diffraction to achieve accurate and reliable detection results, high resolution, and high detection accuracy.

Inactive Publication Date: 2018-03-20
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing technology is mainly based on a specific subsurface damage form or the subsurface damage form of a certain small cross-sectional area is detected. The detection process is often destructive, and the detection results cannot be comprehensively and accurately Reflecting the problem of the subsurface damage form of optical crystal materials in the actual processing process, a nondestructive detection method for subsurface damage in ultra-precision machining of optical crystals is proposed

Method used

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  • Nondestructive testing method for ultra-precision machining sub-surface damage of optical crystal
  • Nondestructive testing method for ultra-precision machining sub-surface damage of optical crystal
  • Nondestructive testing method for ultra-precision machining sub-surface damage of optical crystal

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specific Embodiment approach 1

[0017] Embodiment 1: A non-destructive detection method for subsurface damage in ultra-precision machining of optical crystals. The specific process is as follows:

[0018] combine figure 1 This embodiment will be described. The detection method described in this embodiment is implemented based on the X-ray source 1 , the X-ray detector 3 , and the movable sample stage 4 . The X-ray source 1 can be adjusted in angular position along a circle with the center of the irradiation area as the center, so that the quasi-parallel X-rays generated by it can be incident on the surface of the sample 2 at a certain angle ω. The included angle ω between the incident X-ray and the surface of the sample 2 can be as low as the critical angle of total reflection, and the smaller the included angle, the smaller the detection depth. The sample 3 is placed on a sample stage 4 that can move along the X and Y directions and rotate along the n direction (normal direction of the surface of the test...

specific Embodiment approach 2

[0024] Specific implementation mode two: combination figure 1 This embodiment is described. The difference between this embodiment and the first embodiment is that the quasi-parallel X-rays and diffracted X-rays generated by the X-ray source and the surface normal of the optical crystal to be detected are located in the same plane.

[0025] Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0026] Specific implementation mode three: combination figure 1 This embodiment is described. The difference between this embodiment and the specific embodiment 1 or 2 is that the X-ray sources are generated by different targets and generate X-rays of different wavelengths to meet the needs of different optical crystal surface or subsurface damage detection. ;

[0027] The target material is metal tungsten, copper, cobalt, nickel, iron, silver, palladium, molybdenum or palladium.

[0028] Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.

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Abstract

The invention discloses a nondestructive testing method for ultra-precision machining sub-surface damage of an optical crystal and relates to a nondestructive testing method for ultra-precision machining sub-surface damage, which aims to solve the problems in the prior art that detection is performed based on a certain specific sub-surface damage form or a sub-surface damage form in a certain tinysection area, the detection process often has destructiveness and the detection result cannot comprehensively and accurately reflect the sub-surface damage form of an optical crystal material in theactual machining process. The process comprises the following steps: 1, placing a detected optical crystal on a mobile worktable; 2, enabling X rays generated by an X-ray source to be parallel to thesurface of the detected optical crystal; 3, forming a certain included angle between the X ray and the crystal surface; 4, obtaining diffraction characteristic spectral line information during diffraction of the X ray and the crystal structure; and 5, repeating the steps 3 and 4, and completing nondestructive testing of the ultra-precision machining sub-surface damage of the optical crystal. The method disclosed by the invention is applied to the field of nondestructive test.

Description

technical field [0001] The invention relates to a non-destructive detection method for ultra-precision machining subsurface damage. Background technique [0002] Optical crystals have the characteristics of frequency doubling effect, photoelectric effect, piezoelectric effect, easy phase matching, wide light transmission band or excellent optical uniformity, and play a very important role in cutting-edge science and technology fields such as information communication, aerospace and weaponry. role. Subsurface damage caused by ultra-precision machining will seriously affect the performance and service life of optical crystal devices. Nondestructive testing and evaluation of subsurface damage formed in ultra-precision machining of optical crystals is a difficult and hot spot in the field of ultra-precision machining of optical devices. The existing technology is mainly based on a specific subsurface damage form (such as microcracks, etc.) or a subsurface damage form in a smal...

Claims

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Application Information

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IPC IPC(8): G01N23/20
CPCG01N23/20
Inventor 张勇侯宁梁斌胡旷南
Owner HARBIN INST OF TECH
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