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Cooling and utilization optimization of heat sensitive bonded metal targets

A technology of target material and thermal interface, which is applied in metal material coating process, vacuum evaporation plating, coating, etc.

Inactive Publication Date: 2018-03-27
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the target experiences a thermal load

Method used

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  • Cooling and utilization optimization of heat sensitive bonded metal targets
  • Cooling and utilization optimization of heat sensitive bonded metal targets
  • Cooling and utilization optimization of heat sensitive bonded metal targets

Examples

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Embodiment Construction

[0021] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals refer to the same components. In general, only differences with respect to individual implementations are described. Each example is provided by way of explanation of an embodiment of the disclosure, not limitation of the embodiment. Additionally, features shown or described as part of one embodiment can be used on or in combination with other embodiments to yield a further embodiment. It is intended that the description include such modifications and variations.

[0022] A sputtering source as described herein refers to an assembly comprising a backing support and a magnet assembly. The target material to be sputtered can be applied to the backing support. The backing support can be a plate, cylinder, tube or other structure. The t...

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Abstract

A sputtering source (100) is described. The sputtering source includes a backing support (102) having a target receiving surface (112) and a further surface (110) opposing the target receiving surface, and at least one magnet assembly (115) provided adjacent the further surface, wherein the target receiving surface of the backing support has at least one recess (120), wherein the recess is provided opposite to the magnet assembly.

Description

technical field [0001] Embodiments described herein relate to layer deposition by sputtering from a target. Embodiments described herein relate in particular to a sputter source with a backing support and a method for operating the sputter source, and to an apparatus for sputter deposition on a substrate. Background technique [0002] The techniques used to deposit thin layers on the substrate are in particular evaporation, chemical vapor deposition (Chemical Vapor Deposition; CVD) and sputter deposition (also called Physical Vapor Deposition (Physical Vapor Deposition; PVD)). For example, sputtering may be used to deposit thin layers, such as metal thin layers. During the sputtering process, the coating material is transported from the sputtering target consisting of the material to be deposited on the substrate by bombarding the target surface with ions. During the sputtering process, the target can be electrically biased so that ions generated in the process region can ...

Claims

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Application Information

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IPC IPC(8): H01J37/34C23C14/34C23C14/35
CPCC23C14/3407C23C14/35H01J37/3408H01J37/3417H01J37/3426H01J37/3435H01J37/3497C23C14/165
Inventor 赫尔穆特·格林托马斯·沃纳·兹巴于尔
Owner APPLIED MATERIALS INC