Cooling and utilization optimization of heat sensitive bonded metal targets
A technology of target material and thermal interface, which is applied in metal material coating process, vacuum evaporation plating, coating, etc.
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[0021] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals refer to the same components. In general, only differences with respect to individual implementations are described. Each example is provided by way of explanation of an embodiment of the disclosure, not limitation of the embodiment. Additionally, features shown or described as part of one embodiment can be used on or in combination with other embodiments to yield a further embodiment. It is intended that the description include such modifications and variations.
[0022] A sputtering source as described herein refers to an assembly comprising a backing support and a magnet assembly. The target material to be sputtered can be applied to the backing support. The backing support can be a plate, cylinder, tube or other structure. The t...
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