Method for removing burrs and scraps of wire rack high stamped by-products

Abstract

The invention discloses a method for removing burrs and scraps of wire rack high stamped by-products. The method comprises the steps that firstly, an original material band with burrs and scraps is put on a discharging device, and the starting end of the original material band is pulled to pass through a burr and scrap removal device and is connected to a collection device; and secondly, the burrand scrap removal device, the discharging device and the collection device are started at the same time, then the discharging device rotationally outputs the original material band to the burr and scrap removal device, the collection device rotates synchronously to achieve recovery action, and therefore the original material band is rotated and recovered by the collection device after burr and scrap removal of the burr and scrap removal device so as to form a finished material band. The burr and scrap removal device cooperates with the discharging device and the collection device, then the burrs and the scraps on the wire rack high stamped by-products can be removed, and therefore the eligibility requirement is met so as to improve the percent of pass of the wire rack high stamped by-products to the greatest extent, then the productivity is greatly improved so as to accelerate the production schedule, the increasingly intense requirement is met, and meanwhile further development of theinformation technology can be promoted easily.

Description

【Technical field】 [0001] The present application relates to the technical field of dandruff removal, and in particular to a method for removing dandruff from stamped products with high leads. 【Background technique】 [0002] With the development of information technology, there are more and more requirements for lead frames used in integrated circuits, and the shapes are also more miniaturized and high-precision. There are two production methods of the lead frame: corrosion processing and stamping processing. Although corrosion processing can achieve very fine precision, it cannot achieve high production efficiency and low production cost. With the rapid decline in the price of integrated circuit chips, the use of stamping and forming lead frames is to reduce the price of integrated circuit chips and improve production efficiency. important way. [0003] However, the high-end stamping products of the lead frame formed by the stamping die often have abnormalities such as she...

AI Technical Summary

Problems solved by technology

Although corrosion processing can achieve very fine precision, it cannot achieve high production efficiency and low production cost. With the rapid decline in the price of integrated circuit chips, the use of stamping and forming lead frames is to reduce the price of integrated circuit chips and improve production efficiency. an important way

[0003] However, the high-end stamping products of the lead frame formed by the stamping die often have abnormalities such as shedding fine burrs, which in turn lead to abnormal quality and unqualified products, which not only greatly reduces the qualified rate of the products, but also greatly reduces the quality of the products. Reduce production efficiency and affect the production progress of production enterprises, which can not meet the increasingly tense demand, and also restrict the further development of information technology

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