Device for removing soft flocks on lead frame high-frequency stamped product

Abstract

The invention discloses a device for removing soft flocks on a lead frame high-frequency stamped product. The device comprises a soft flock removing device used for removing the soft flocks on an original strip, a containing device arranged on the left side of the soft flock removing device and used for carrying the original strip and rotatably outputting the original strip to the soft flock removing device and a receiving device which is arranged on the right side of the soft flock removing device, and used for rotatably recycling the finished strip obtained after the soft flocks are removedfrom the original strip by the soft flock removing device. Through cooperation of the soft flock removing device, the containing device and the receiving device, burrs and fines on the lead frame high-frequency stamped product can be removed, the qualified needs are met, the yield of the lead frame high-frequency stamped product is improved to the maximum limit, the production rate is greatly improved, the production schedule is quickened, the increasingly intense needs are met, and meanwhile, further development of information technology is promoted.

Description

【Technical field】 [0001] The present application relates to the technical field of dandruff removal, in particular to a device for removing dandruff from stamped products with high leads. 【Background technique】 [0002] With the development of information technology, there are more and more requirements for lead frames used in integrated circuits, and the shapes are also more miniaturized and high-precision. There are two production methods of the lead frame: corrosion processing and stamping processing. Although corrosion processing can achieve very fine precision, it cannot achieve high production efficiency and low production cost. With the rapid decline in the price of integrated circuit chips, the use of stamping and forming lead frames is to reduce the price of integrated circuit chips and improve production efficiency. important way. [0003] However, the high-end stamping products of the lead frame formed by the stamping die often have abnormalities such as sheddin...

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Problems solved by technology

Although corrosion processing can achieve very fine precision, it cannot achieve high production efficiency and low production cost. With the rapid decline in the price of integrated circuit chips, the use of stamping and forming lead frames is to reduce the price of integrated circuit chips and improve production efficiency. an important way

[0003] However, the high-end stamping products of the lead frame formed by the stamping die often have abnormalities such as shedding fine burrs, which in turn lead to abnormal quality and unqualified products, which not only greatly reduces the qualified rate of the products, but also greatly reduces the quality of the products. Reduce production efficiency and affect the production progress of production enterprises, which can not meet the increasingly tense demand, and also restrict the further development of information technology

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