Mobile terminal, flexible circuit board and manufacturing method of flexible circuit board
一种柔性电路板、制造方法的技术，应用在电子领域，能够解决FPC柔韧性影响、厚度增加等问题，达到好信号传输质量、减少厚度、提升柔韧性的效果
Inactive Publication Date: 2018-05-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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Problems solved by technology
However, since FPC needs to have better flexibility, increasing the number of layers of FPC to increase its thickness will undoubtedly affect the flexibility of FPC.
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] For ease of description, spatially relative terms such as "under", "beneath", "below", "above", "on" and other spatially relative terms may be used herein to describe an element as shown in the drawings Or the relationship of a feature to another element or feature(s). It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly on, or directly...
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The invention provides a flexible circuit board. A first wiring region, a second wiring region and a third wiring region are formed and sequentially connected, the widths of the first wiring region and the third wiring region are larger than the width of the second wiring region, so that the flexible circuit board is integrally of an I-shaped structure. The flexible circuit board comprises a conductive layer, a coverage film layer and a shielding film layer, wherein the conductive layer comprises a plurality of conductive circuits and a plurality of grounding regions, each conductive circuit is arranged on the second wiring region, the plurality of grounding regions are arranged on the first wiring region and the third wiring region, the coverage film layer comprises a plurality of openings, the plurality of openings are in one-to-one correspondence to the plurality of grounding regions of the conductive layer, and the shielding film layer is electrically connected with the plurality of grounding regions via the plurality of openings so as to form a grounding path between the first wiring region and the third wiring region. Moreover, the invention also provides a mobile terminal and a manufacturing method of the flexible circuit board. The flexible circuit board has relatively good flexibility.
Description
technical field [0001] The invention relates to the field of electronic technology, in particular to a mobile terminal, a flexible circuit board and a manufacturing method thereof. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit, FPC) is a printed circuit board made of flexible insulating substrates, which has many advantages that rigid printed circuit boards (Printed Circuit board, PCB) do not have, such as FPC can be bent freely, roll Winding and folding can be arranged arbitrarily according to the requirements of space layout, so as to achieve the integration of component assembly and wire connection. Due to the above advantages, the use of FPC can effectively reduce the volume of electronic products, increase the flexibility of circuit layout, and meet the needs of electronic products in the direction of high density, miniaturization, and high reliability. At present, FPC has been widely used in aerospace, military, mobile communic...
Claims
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IPC IPC(8): H05K1/02
CPCH05K1/0225H05K1/118H05K3/0011H05K2201/096
Inventor 陈艳
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD