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Heat spreaders with optimized thermal expansion and/or heat transfer coefficients

A technology of thermal expansion coefficient and coefficient of expansion, applied in the field of semiconductor packaging, can solve problems such as high cost, excessive time, and unreliability

Active Publication Date: 2020-06-09
NLIGHT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These measures may be unreliable and implementing measures to reduce mechanical stress may take too much time and cost

Method used

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  • Heat spreaders with optimized thermal expansion and/or heat transfer coefficients
  • Heat spreaders with optimized thermal expansion and/or heat transfer coefficients
  • Heat spreaders with optimized thermal expansion and/or heat transfer coefficients

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Embodiment Construction

[0028] As used in this application and the claims, the words "a," "an" and "the" in the singular include plural referents unless the context clearly dictates otherwise. Furthermore, the term "comprising" means "comprising". Furthermore, the term "coupled" does not exclude the presence of intermediate elements between the coupled items.

[0029]The systems, devices and methods described herein should not be construed as limiting in any way. Rather, the present disclosure relates to all novel and non-obvious features and aspects of the various disclosed embodiments, individually and in various combinations and subcombinations with each other. The disclosed systems, methods and apparatus are not limited to any particular aspect or feature or combination thereof, nor do the disclosed systems, methods and apparatus claim that any one or more particular advantages exist or problems are solved. Any theory of operation is presented for convenience of explanation, but the disclosed s...

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Abstract

The present invention discloses methods, systems and apparatus relating to a heat spreader to be coupled to a heat source having a heat source coefficient of thermal expansion (HS CTE), the heat spreader comprising an anisotropic material with a high axis of expansion. The heat spreader also includes a surface to be coupled to the heat source, wherein the high expansion axis of the anisotropic material is inclined to the surface of the heat spreader, and wherein the anisotropic material The high expansion axis is oriented at a first angle of rotation about a first axis of the heat spreader, wherein the first angle of rotation is selected to optimize matching of a first CTE of the heat spreader to the HS CTE .

Description

[0001] Cross references to related patent applications [0002] This application claims the benefit of US Provisional Patent Application: 62 / 205,853, filed August 17, 2015, which is hereby incorporated by reference for all purposes. technical field [0003] Generally, the field of technology disclosed in this invention is semiconductor packaging. More specifically, the disclosed technology involves matching the coefficient of thermal expansion of the materials used in the package to that of the heat source. Background technique [0004] Semiconductor devices are fragile and are often assembled in packages to protect the device from damage due to thermal and mechanical stress, corrosion, contamination, etc. Semiconductor packages often include heat dissipating components, such as heat dissipating layers, heat spreaders, and / or heat sinks. [0005] A laser diode is a semiconductor device. In gallium arsenide (GaAs) and indium phosphide (InP)-based laser packages, the lasers...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H01S3/04H01L21/02
CPCH01L23/36H01L23/373H01S5/02476
Inventor W·桑德斯M·坎斯卡
Owner NLIGHT INC