Combination of patterned metal wire and substrate

Abstract

A combination of patterned metal wire and a substrate having the metal wire formed thereon, the metal wire comprising: an oxide layer including indium and zinc; and a copper-based layer disposed on orunder the oxide layer including indium and zinc, wherein a zinc oxide amount of the oxide layer including indium and zinc is equal to or more than 10% by weight and less than about 35% by weight. A wet etching composition usable for etching a copper-based wiring layer includes between about 40% by weight to about 60% by weight of phosphoric acid, between about 1% by weight to about 10% by weightof nitric acid, between about 3% by weight to about 15% by weight of acetic acid, between about 0.01% by weight to about 0.1% by weight of a copper-ion compound, between about 1% by weight to about 10% by weight of a nitric salt, between about 1% by weight to about 10% by weight of an acetic salt, and a remainder of water.

Description

[0001] This application is a divisional application of an invention patent application with an application date of June 26, 2013, an application number of 201310260941.4, and an invention title of "a combination of a patterned metal wire and a substrate". technical field [0002] The present disclosure relates to a metal wiring (wiring) etchant composition, to a metal wiring formed using the etchant composition and to a method of manufacturing a display substrate. More specifically, the exemplary embodiments relate to an etchant composition for etching a metal wiring layer containing copper as a main component, to metal wiring formed by using the etchant composition, and to manufacturing a display substrate using the etchant composition. method. Background technique [0003] Typically, a flat or curved display (eg, a liquid crystal display or LCD) includes a display substrate having patterned wiring formed entirely thereon for interconnecting circuits such as thin film trans...

AI Technical Summary

Problems solved by technology

However, such persulfate-based etchants tend to be unstable when stored at room temperature, and they are limited in terms of the maximum amount of substrates that can be processed by a predetermined amount of etchant solution

[0006] Furthermore, when trying to reduce the RC delay problem by increasing the thickness of the signal line, the copper wiring formed by conventional etchants may develop undesirably small (sharper) by increasing the size of the base of the wiring cross-section. Compensate the base cone angle, thereby undesirably reducing the opening ratio (opening ratio) of the pixel area of ​​the display device (opening ratio, aperture ratio)

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