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Heat dissipation water discharge structure

A technology of water drain and heat dissipation fin set, which is applied in the fields of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of inability to adjust the structure of the water cooling drain, poor heat dissipation efficiency, poor antipyretic effect, etc. , to achieve good antipyretic efficiency, increase heat exchange time, and improve heat dissipation efficiency

Active Publication Date: 2018-05-22
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] After the working liquid flowing in from the water inlet 13 is in the water tank 13 on one side, it flows straight through quickly from the straight flat tubes 12 to the water tank 13 on the other side, and then by means of the straight The strip-shaped flat tube 12 quickly passes through the water tank 13 on the side of the channel, and then is discharged from the water outlet 132, so the working liquid with heat enters the water-cooled row 1 for a short time, relatively making the heat The heat exchange time between the working liquid and the water-cooled radiator is not long, which leads to the poor cooling effect of the existing water-cooled radiator on the working liquid with heat, which in turn causes the problem of poor heat dissipation efficiency
In addition, since the overall structure of the existing water-cooling radiator cannot be adjusted and changed in response to the space in an electronic device, when placed in an electronic device, an independent space is required in the electronic device for the placement of the existing water-cooling radiator.

Method used

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  • Heat dissipation water discharge structure
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Embodiment Construction

[0046] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings. Various implementations of the present invention will be described in detail below, please refer to the drawings and their symbols and descriptions.

[0047] The invention relates to a cooling water drainage structure. Please refer to figure 2 It is a three-dimensional combination schematic diagram of an implementation of the present invention; Figure 2A It is a three-dimensional combination cross-sectional schematic diagram of an implementation of the present invention; Figure 3A It is a three-dimensional exploded schematic diagram of an implementation of the present invention; Figure 3B It is another three-dimensional exploded schematic diagram of an implementation of the present invention; Figure 3C for the invention Figure 3A The three-dimensional local enlarged schema...

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Abstract

The invention provides a heat dissipation water discharge structure. The structure comprises a liquid-containing plate set and a first turbulence set, wherein the liquid-containing plate set comprisesa first liquid-containing plate and a second liquid-containing plate, the first liquid-containing plate is provided with a first liquid chamber communicated with at least one inlet, an operating fluid flows into the first liquid chamber through the inlets, the second liquid-containing plate is provided with a second liquid chamber communicated with at least one outlet, at least one communicatingpipe is communicated with the first liquid chamber and the second liquid chamber, and the first turbulence set is selectively arranged in one of the first liquid chamber and the second liquid chamber.

Description

technical field [0001] The invention relates to a heat dissipation water drainage structure, in particular to a heat dissipation water drainage structure capable of achieving good heat dissipation effect. Background technique [0002] When the computer is running, many internal components will generate a lot of heat, so a good heat dissipation system is a key factor in determining the performance and reliability of the computer. Among all the components that generate heat, the central processing unit (CPU) and graphics processing unit (GPU), which have the highest workload, generally have the most difficult heat dissipation problems. Especially at present, the pictures of various computer games are becoming more and more delicate, and the functions of computer-aided graphics software are also becoming more and more powerful. This kind of software often makes the central processing unit and graphics chip processor in a high-load state when it is running, and it will also caus...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 刘汉敏
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD