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Logic device temperature control method

A temperature control method and technology of logic devices, which can be used in instruments, digital data processing components, electrical digital data processing, etc., can solve problems such as work, and achieve cost-saving effects

Inactive Publication Date: 2018-05-25
FAFA AUTOMOBILE (CHINA) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to improve the temperature control method and logic device of a kind of logic device in view of the technical problem that the logic device of the prior art cannot work at a temperature lower than its working level, and greatly save the cost, such a low working level The chips combined with the method of the present invention can meet the requirements of high-level chips

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  • Logic device temperature control method
  • Logic device temperature control method
  • Logic device temperature control method

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0026] Such as figure 1 Shown is a temperature control method for a logic device provided by an embodiment of the present invention, including:

[0027] Step S101, setting at least one register of the logic device as a temperature control register, and inputting a waveform for inversion at an inversion frequency and transmission at a transmission frequency to the temperature control register;

[0028] Step S102, controlling the temperature of the logic device by adjusting the parameters of the waveform input to each of the registers, or controlling the temperature of the logic device by adjusting the number of temperature control registers.

[0029] Logic devices, such as FPGAs, include multiple registers, and the dynamic power consumption of each register varies with the input waveform. Therefore, in step S101, several registers in some logic devices are set as temperature control registers, for example figure 2 Register 21 in . Then input waveforms to the register, such ...

Embodiment 2

[0032] Such as image 3 Shown is a temperature control method for a logic device provided by an optional embodiment of the present invention, including:

[0033] Step S301, setting at least one register of the logic device as a temperature control register, and inputting a waveform for inversion at an inversion frequency and transmission at a transmission frequency to the temperature control register;

[0034] Step S302, monitoring the temperature of the logic device, when the temperature of the logic device is inconsistent with the preset temperature, adjusting the parameters of the waveform input to each of the registers to control the temperature of the logic device, or adjusting The number of temperature control registers is used to control the temperature of the logic device.

[0035] The temperature of the logic device can be monitored by an off-chip or on-chip temperature sensor of the logic device.

[0036] Specifically, it can be:

[0037] When the temperature of t...

Embodiment 3

[0050] Such as Figure 4 Shown is a block diagram of a logic device provided by an embodiment of the present invention, including:

[0051] A temperature control register setting module 401, configured to: set at least one register of the logic device as a temperature control register, and input a waveform that is flipped at an inversion frequency and transmitted at a transmission frequency to the temperature control register;

[0052] The temperature adjustment module 402 is configured to: control the temperature of the logic device by adjusting the parameters of the waveform input to each of the registers, or control the temperature of the logic device by adjusting the number of temperature control registers .

[0053] The embodiment of the present invention controls the dynamic power consumption of the register by inputting a waveform to the register, thereby implementing a controllable heat generating circuit in the logic device to control the temperature of the device, so ...

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PUM

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Abstract

Embodiments of the invention disclose a logic device temperature control method. The method comprises the following steps of: setting at least one register of a logic device as a temperature control register, and inputting waveforms which are overturned via an overturn frequency and transmitted via a transmission frequency to the temperature control registers; and controlling the temperature of the logic device through adjusting parameters of the waveform input into each register, or controlling the temperature of the logic device through adjusting the quantity of the temperature control registers. According to the method, waveforms are input to registers to control the dynamic power consumption of the registers, so that controllable heat generation circuits are realized in logic devices to control the temperatures of the devices, thereby enabling low-working level chips to realize requirements of high-working level chips and greatly saving the cost.

Description

technical field [0001] The invention relates to the field of electronic related technologies, in particular to a temperature control method of a logic device. Background technique [0002] Generally speaking, electronic devices, such as logic devices, are specifically Field-Programmable Gate Array chips (Field-Programmable Gate Array, FPGA), which are divided into the following four types according to temperature grades: commercial-grade chips (0-70 degrees), industrial Grade chips (-40-85 degrees), military grade chips (-55-125 degrees), automotive grade chips (-55-125 degrees). Due to various factors such as production quantity and process complexity. It is reflected in the great difference in the final chip price. Every time a level is upgraded, the price will increase by at least 15% to 25%. [0003] It can be seen that the low temperature operating range is an important requirement for the chip level. Logic devices with low operating levels cannot operate at high ope...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/206Y02D10/00
Inventor 赵亦彤
Owner FAFA AUTOMOBILE (CHINA) CO LTD