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Protective film bonding device and bonding method

A technology of laminating device and protective film, applied in packaging and other directions, can solve the problems of indentation on product surface, expensive equipment, puncture of OLED or TFE film layer, etc., to reduce the probability of bubble generation and avoid bubbles. Create and avoid indentation and breakage effects

Active Publication Date: 2019-09-17
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most panel manufacturers' OLED touch (organic light-emitting display touch) technology is still immature, so they will outsource the touch process, that is, make the touch panel and protective film into TP film (touch panel film). For similar products, The existing method of using roller film sticking will easily form indentations on the product surface, and if the factory environmental control is not good, resulting in more particles (particles) on the product surface, the risk of OLED or TFE film layer being pierced will be greatly increased. Increase
In addition, the existing technology needs to purchase additional defoaming equipment, and the equipment cost is relatively expensive
Furthermore, the existing technology cannot be fully compatible with strip-shaped protective films and sheet-shaped protective films, that is, the same equipment cannot meet the attachment requirements of strip stickers and surface stickers at the same time.

Method used

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  • Protective film bonding device and bonding method
  • Protective film bonding device and bonding method
  • Protective film bonding device and bonding method

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] refer to figure 1 with figure 2 , the protective film bonding device of the embodiment of the present invention includes a stage 10, a pressure plate 20, a lifting mechanism 30 and an upper shell 40, the stage 10 is used to place the substrate 1 to be filmed, the pressure plate 20 is arranged opposite to the stage 10, and The pressing plate 20 is arranged above the stage 10, and includes a plurality of first grooves 21 for air to pass through, a first channel 22 communicating with all the first grooves 21, and a first air inlet 23 on the surface facing the stage 10. An air inlet 23 and...

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Abstract

A device for laminating a protective film, and a laminating method for the same. The device comprises: a platform (10) for supporting a substrate (1) to be laminated; a pressing board (20) disposed opposed to and above the platform (10), the pressing board comprising several first slots (21) for air passage on a surface thereof facing the platform (10), a first channel (22) communicating with all of the first slots (21), and a first air inlet hole (23), the first air inlet hole (23) being on a different surface of the pressing board (20) than the first slots (21); and a first vacuum generation device in communication with the first air inlet hole (23) and generating a vacuum suction force to attach a protective film to a surface of the pressing board (20). The platform (10) and the pressing board (20) can approach each other to laminate protective film onto a surface of the substrate (1). The technical solution reduces the probability of bubble generation during a pressing and lamination process, achieves precision lamination of protective film, eliminates creases and folding damage caused by a film lamination process, prevents particles from piercing through a film layer of a product, and meets lamination requirements for both strips and sheets.

Description

technical field [0001] The invention relates to the technical field of film bonding, in particular to a protective film bonding device and bonding method. Background technique [0002] The protective film lamination process (Top laminator) is generally after the TFE (Thin Film Encapsulation, thin film encapsulation) process or the Touch process (touch panel process). The purpose of the process is to attach a layer of PET (Polyethylene terephthalate, poly The protective film made of ethylene terephthalate) prevents the product from being damaged in the subsequent process and causing the product to be scrapped. [0003] At present, most panel manufacturers' OLED touch (organic light-emitting display touch) technology is still immature, so they will outsource the touch process, that is, make the touch panel and protective film into TP film (touch panel film). For similar products, The existing method of using roller film sticking will easily form indentations on the product su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B33/02
Inventor 王璟
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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