Protective film bonding device and bonding method
A technology of laminating device and protective film, applied in packaging and other directions, can solve the problems of indentation on product surface, expensive equipment, puncture of OLED or TFE film layer, etc., to reduce the probability of bubble generation and avoid bubbles. Create and avoid indentation and breakage effects
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[0029] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0030] refer to figure 1 with figure 2 , the protective film bonding device of the embodiment of the present invention includes a stage 10, a pressure plate 20, a lifting mechanism 30 and an upper shell 40, the stage 10 is used to place the substrate 1 to be filmed, the pressure plate 20 is arranged opposite to the stage 10, and The pressing plate 20 is arranged above the stage 10, and includes a plurality of first grooves 21 for air to pass through, a first channel 22 communicating with all the first grooves 21, and a first air inlet 23 on the surface facing the stage 10. An air inlet 23 and...
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