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Multilayered printed circuit board and manufacturing process thereof

A printed circuit board and manufacturing process technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as adhesive overflow and uneven overall thickness of multilayer printed circuit boards, making it difficult to crack , avoid bubble residual defects, and the overall structure is uniform

Inactive Publication Date: 2018-06-01
HANGZHOU TIANFENG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, because of the flow characteristics of the adhesive hot pressing, it is easy for the excess adhesive to overflow from the edges of the two circuit boards, resulting in uneven overall thickness of the multilayer printed circuit board.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A multi-layer printed circuit board, including a first circuit board, a second circuit board and a third circuit board stacked in sequence, a layer of thermal pressure layer is respectively arranged between each circuit board, and the circuit layer is adjacent to all A plurality of dam strips are arranged on the edge area of ​​one side surface of the heat-pressed layer, and a plurality of grooves are arranged between adjacent dam strips, and the grooves communicate with each other.

[0022] The heat-pressing layer is pressed between the first circuit board and the second circuit board, and the heat-pressing layer is partially accommodated in the groove between the spoiler bars.

[0023] A manufacturing process of a multilayer printed circuit board, comprising the steps of:

[0024] Step 1: providing a first circuit board, the first circuit board is provided with a plurality of baffle strips in the edge area of ​​the surface surface, and a plurality of grooves are provid...

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PUM

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Abstract

The invention discloses a multilayered printed circuit board. The multilayered printed circuit board comprises a first circuit board, a second circuit board, a third circuit board and a hot pressing layer; the first circuit board, the second circuit board and the third circuit board are arranged at intervals oppositely; the hot pressing layer is positioned between the adjacent circuit boards; multiple current blocking strip structures are arranged on the edge regions, close to one side surface of the hot pressing layer, of the circuit boards; multiple trenches are formed between the adjacent current blocking strips; and the trenches are in interconnection. The invention also provides a manufacturing process of the multilayered printed circuit board. The multilayered printed circuit board and the manufacturing process thereof have the advantages of uniform thickness and no easy cracking.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a multilayer printed circuit board and a manufacturing process thereof. Background technique [0002] Nowadays, the cost of printed circuit boards is gradually reduced, the degree of integration is gradually increased, and at the same time, it has many advantages such as more portability and versatility. Therefore, printed circuit boards currently occupy the high ground of many products in the industrialization era. [0003] Currently, a multilayer printed circuit board generally includes at least two circuit boards and an adhesive layer sandwiched between the circuit boards. The adhesive layer is respectively sandwiched between each adjacent circuit board, and the circuit boards are bonded to form a multi-layer printed circuit board. The adhesive layer may consist of conventional adhesives (acrylates, epoxies, polyamides, phenolic resins, etc.), which are cured during m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4626H05K2203/068
Inventor 吴民
Owner HANGZHOU TIANFENG ELECTRONICS CO LTD