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Packaging method of light-emitting diode and light-emitting diode

A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of large finished product volume, high production cost, inconvenient automatic production, etc., and achieve the effect of simple process, strong applicability, and low cost

Pending Publication Date: 2018-06-08
HEYUAN FUYU OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The production cost of the pin insertion package is relatively small, and users can produce different finished products with different appearances and different lighting angles according to different needs, but the overall finished product is relatively large, and it is not convenient for users to automate production; Smaller, but the appearance of the finished product and the lighting angle / photoelectric effect are relatively simple, and the production cost is relatively high

Method used

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  • Packaging method of light-emitting diode and light-emitting diode
  • Packaging method of light-emitting diode and light-emitting diode
  • Packaging method of light-emitting diode and light-emitting diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as figure 1 As shown, the implementation of the present invention provides a method for packaging light-emitting diodes, including the following steps:

[0032] S110 Set the lead frame: the lead frame includes a shell and a supporting plate, the upper and lower sides of the shell are connected to form a through hole, the supporting plate is arranged at the lower part of the through hole, and is closed and connected with the surrounding surfaces, and the supporting plate is provided with a plate that passes through the supporting plate up and down. There are mounting holes for guide pins on the bottom surface, and the chip mounting part is set on the upper surface of the pallet;

[0033] The lead frame is set as a launch type lead frame, and the upper surface of the supporting plate and the surrounding walls of the housing form an arc, the arc of the surrounding walls of the upper surface of the supporting plate forms a reflective cup, and the chip mounting part is ...

Embodiment 2

[0043] Such as figure 2 , 3 As shown, the embodiment of the present invention also provides a light-emitting diode, including a lead frame 1, a bottom surface guide pin 4, a light-emitting diode chip 5, a first colloid 7, a second colloid 8,

[0044] The lead frame 1 includes a housing 2 and a supporting plate 3. The upper and lower sides of the housing 2 are connected to form a through hole. The supporting plate 3 is arranged at the lower part of the through hole and is closed and connected with the surrounding surfaces. The supporting plate 3 is provided with a vertically penetrating supporting plate 3 The bottom guide pin installation hole of the bottom surface, the chip installation part is arranged on the upper surface of the supporting plate 3; the bottom surface guide pin 4 is fixed in the bottom surface guide pin installation hole, the light emitting diode chip 5 is fixed in the chip installation part, the light emitting diode chip 5 and the bottom surface guide pin 4...

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PUM

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Abstract

The invention discloses a packaging method of a light-emitting diode. The packaging method comprises the following steps that a lead frame is arranged: the lead frame comprises a shell and a support plate, the upper and lower surfaces of the shell are communicated to form a through hole, the support plate is arranged on the lower part of the through hole and connected with the peripheral surfacesin a closed way, the support plate is provided with bottom surface guide pin installing holes vertically penetrating through the support plate, and the upper surface of the support plate is provided with a chip installing part; bottom surface guide pins are arranged: the bottom surface guide pins are fixed in the bottom surface guide pin installing holes; a light-emitting diode chip is arranged: the light-emitting diode chip is fixed on the chip installing part and the light-emitting diode chip and the bottom surface guide pins are electrically connected; first gel packaging is performed: thefirst time of gel packaging is performed in the space formed by the upper surface of the support plate and the shell through the gel; and second gel packaging is performed: and the second time of gelpackaging is performed on the gel after the first time of gel packaging. The invention also discloses the light-emitting diode. According to the technical scheme, the packaging process is simple, thepackaging cost is low and various packaging demands can be met.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a method for manufacturing a light emitting diode and the light emitting diode. Background technique [0002] LED (Light Emitling Diode, Light Emitting Diode) packaging uses a bracket (lead frame) to carry the chip, uses silver glue or metal connecting wires for internal and external electrical connections, and uses colloid for external protection and optical lens applications. Encapsulation can protect the LED and increase the optoelectronic performance, which is necessary for the LED. [0003] Currently, most LED semiconductor devices are packaged in pin-insert and surface-mount packages. The pin insertion packaging process is as follows: use die-bonding glue to fix the chip on the metal bracket, and use metal wires to connect the electrodes. After realizing the electrical function connection, insert into the molding cavity and inject liquid epoxy resin; after the epoxy re...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/52H01L33/62H01L33/58
CPCH01L33/48H01L33/52H01L33/58H01L33/62
Inventor 赵志勇
Owner HEYUAN FUYU OPTOELECTRONICS TECH CO LTD