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Polyimide laminate and method for producing same

A technology of polyimide layer and polyimide, applied in the direction of chemical instruments and methods, coatings, layered products, etc., can solve the warping of laminated bodies, insufficient suppression effect, and inability to miniaturize the display part, etc. problem, to achieve the effect of suppressing warpage and good precision

Active Publication Date: 2018-06-08
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, the coefficient of thermal expansion relative to the glass substrate is several ppm / K, and the resin generally has a coefficient of thermal expansion of several tens of ppm / K or more, so there is a possibility that the laminate may warp and miniaturization of the display part may not be possible.
[0011] In this regard, Patent Document 3 discloses that a resin layer (b) having a coefficient of thermal expansion between the support substrate and the resin film (a) is provided between the support substrate and the resin film (a), but the effect of suppressing warpage is not sufficient. insufficient

Method used

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  • Polyimide laminate and method for producing same
  • Polyimide laminate and method for producing same
  • Polyimide laminate and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0083] Hereinafter, the present invention will be specifically described based on Examples and Comparative Examples. Furthermore, the present invention is not limited by these contents.

[0084] First, the meaning of the abbreviation used below, the evaluation method of the physical property etc. in an Example etc. are shown.

[0085] PMDA: pyromellitic dianhydride

[0086] BPDA: 3,3′,4,4′-biphenyltetracarboxylic dianhydride

[0087] 6FDA: 2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride

[0088] AAPBZ: 5-amino-2-(4-aminophenyl)benzimidazole

[0089] BAPP: 2,2′-bis(4-aminophenoxyphenyl)propane

[0090] TFMB: 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl

[0091] DMAc: N,N-Dimethylacetamide

[0092] GBL: γ-butyl lactone

[0093] 〔Transmittance(%)〕

[0094] The light transmittance at 500 nm was calculated|required with respect to a polyimide film (50mmx50mm) using the U4000 type|mold spectrophotometer.

[0095] 〔Coefficient of thermal expansion (CTE)〕

[009...

Synthetic example 1

[0112] Under nitrogen flow, TFMB: 8.49 g was dissolved in 85 g of GBL as a solvent while stirring in a 100 ml separable flask. Next, PMDA: 5.04 g was added to this solution. After 10 minutes the anhydride 6FDA: 1.47 g was added. The molar ratio of acid anhydride and diamine was set to 0.998. Afterwards, the solution was continuously stirred at room temperature for 4 hours and polymerized for one day and night. Then, a viscous colorless polyamic acid solution was obtained, and production of polyamic acid A with a high degree of polymerization was confirmed.

Synthetic example 2

[0113] Synthesis Example 2 to Synthesis Example 7

[0114]Except having changed acid anhydride and diamine into the mass composition shown in Table 1, it carried out similarly to the synthesis example 1, and prepared the polyamic-acid solution, and obtained polyamic-acid (resin) B - polyamic-acid (resin) G.

[0115] [Table 1]

[0116] Weight (g)

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Abstract

Provided are a polyimide laminate with which warping is suppressed and with which it is possible to easily and conveniently separate a resin base material, and a method for producing same. Provided isa laminate provided with a plurality of polyimide layers of, in sequence, a first polyimide layer and a second polyimide layer on a support body having a thermal expansion coefficient of 1-10 ppm / K,said polyimide laminate being characterized in that: the first polyimide layer has a film thickness of 1-50 [mu]m, a thermal expansion coefficient that is at least the thermal expansion coefficient ofthe support body and is 5-30 [mu]m, and a glass transition temperature of at least 300 DEG C; that the second polyimide layer has a film thickness of 5-30 [mu]m and a thermal expansion coefficient that is at least the thermal expansion coefficient of the first polyimide layer; and that the first polyimide layer and the second polyimide layer can be peeled at the interface thereof. Further provided is a method for producing the polyimide laminate in which a resin solution of a polyimide or a polyimide precursor is sequentially applied, dried, and heat-treated to form each of the polyimide layers.

Description

technical field [0001] The present invention relates to a polyimide laminate formed by laminating a first polyimide layer and a second polyimide layer on a support and a method for manufacturing the same. A polyimide laminate including a second polyimide layer and having a display section provided on a flexible resin substrate, and a method for producing the same. Background technique [0002] Display devices such as liquid crystal display devices or organic electroluminescence (EL) display devices are widely used in large displays such as televisions to small displays such as mobile phones, personal computers, and smart phones. For example, in an organic EL display device, a thin film transistor (Thin Film Transistor, TFT) is formed on a glass substrate, and an electrode, a light-emitting layer, an electrode, etc. are sequentially formed, and finally a glass substrate or a multi-layer thin film is used for hermetic sealing. production. [0003] Here, the type of display d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/34B05D1/38B05D7/24
CPCB05D7/24B05D1/38B32B27/34B32B7/06B32B27/08B32B27/281C08G73/1039C08G73/1075B32B2307/30B32B2307/40B32B2457/20B32B7/023B32B7/022
Inventor 王宏远藤元伸悦平石克文山田裕明
Owner NIPPON STEEL CHEM &MATERIAL CO LTD