Resin composition, bonding body and semiconductor device

Abstract

The resin composition of the present invention has a binder resin and silver-coated particles with functional groups introduced into the surface, and the tensile modulus (a) of the silver-coated particles is related to the tensile strength of the binder resin after curing. The elastic modulus (b) ratio (a / b) is 0.1-2.0, and the tensile elastic modulus (a) of the silver-coated particles is 0.05-2.0 GPa.

Description

technical field [0001] The present invention relates to a resin composition that can be used when mounting a semiconductor element on an insulating circuit board or the like, a bonded product bonded using the resin composition, and a semiconductor device. [0002] This application claims priority based on Patent Application No. 2015-212947 filed in Japan on October 29, 2015 and Patent Application No. 2016-150723 filed in Japan on July 29, 2016, and the contents thereof are incorporated herein. Background technique [0003] A semiconductor device such as an LED or a power module has a structure in which a semiconductor element is bonded on a circuit layer made of a conductive material. [0004] In power semiconductor devices for high-power control used to control wind power generation, electric vehicles, hybrid vehicles, etc., the amount of heat generated is large. Therefore, as a substrate on which the above-mentioned power semiconductor element is mounted, for example, a s...

AI Technical Summary

Problems solved by technology

[0011] However, in the resin compositions disclosed in Patent Document 1 and Patent Document 2, in the adhesive layer formed by curing the resin composition, heat is generated inside the adhesive layer due to the difference in thermal expansion coefficient of each material. local concentration of stress

Therefore, there is a problem that the adhesive layer is cracked due to the concentration of thermal stress, and the durability and reliability are reduced.

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