A kind of WC cemented carbide film and its preparation method at room temperature by gradient layer technology
A cemented carbide, gradient layer technology, applied in metal material coating process, coating, vacuum evaporation coating and other directions, can solve the problems of feasibility that cannot meet the requirements, no reports, etc., to achieve excellent crystal quality and improve crystal quality , the effect of dense thickness
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Embodiment 1
[0030] The method for growing WC cemented carbide film at room temperature by gradient layer technology of the present invention is specifically:
[0031]1) Using the DC magnetron sputtering method, stainless steel is used as the substrate, and it is bombarded by Ar plasma before use; high-purity W metal is selected as the target material; high-purity Ar gas is used as the working gas, and when the reaction chamber is pumped to the background Vacuum degree higher than 1×10 –4 After Pa, the Ar gas was introduced, and the gas pressure was kept at 1.0 Pa during the deposition process; the W film was grown in an Ar plasma atmosphere, the growth temperature was room temperature, and the growth time was 12 min.
[0032] 2) After the growth of the W bottom film is completed, the sputtering and deposition process of the film is still maintained, and another channel of CH is immediately connected. 4 Gas; adjust for Ar and CH 4 The divider ratio, CH 4 The increase rate of the partial...
Embodiment 2
[0035] The method for growing WC cemented carbide film at room temperature by gradient layer technology of the present invention is specifically:
[0036] 1) Using the DC magnetron sputtering method, stainless steel is used as the substrate, and it is bombarded by Ar plasma before use; high-purity W metal is selected as the target material; high-purity Ar gas is used as the working gas, and when the reaction chamber is pumped to the background Vacuum degree higher than 1×10 –4 After Pa, the Ar gas was introduced, and the gas pressure was kept at 1.0 Pa during the deposition process; the W film was grown in an Ar plasma atmosphere, the growth temperature was room temperature, and the growth time was 12 min.
[0037] 2) After the growth of the W bottom film is completed, the sputtering and deposition process of the film is still maintained, and another channel of CH is immediately connected. 4 Gas; adjust for Ar and CH 4 The divider ratio, CH 4 The increase rate of the partia...
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