Multi-combined heat pipe cooling system with underfloor type microchannel heat exchanger
A technology of micro-channel heat exchanger and multi-connected heat pipe, which is applied in the field of micro-channel heat exchanger bottom-mounted multi-connected heat pipe cooling system, can solve the problem of low heat exchange efficiency, achieve fast heat exchange speed, prolong service life and high efficiency high effect
Inactive Publication Date: 2018-06-15
镇江常畅光伏电子有限公司
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[0003] The purpose of the present invention is to provide a multi-connected heat pipe cooling system with a bottom-mounted micro-channel heat exchanger for the problem of low heat exchange efficiency in the actual application of the existing multi-connected heat pipe cooling system in a backplane type communication room
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[0013] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.
[0014] Such as figure 1 As shown, the microchannel heat exchanger bottom-mounted multi-connected heat pipe cooling system includes a cabinet 1, a cold air channel 2, an AC centrifugal fan 5, a microchannel heat exchanger 3 and an overhead layer 7, and an overhead layer 7 is provided below the cabinet 1 , the end of the overhead floor 7 is open, and there is a cold air passage 2 between each two cabinets 1, and an AC centrifugal fan 5 is arranged below the cold air passage 2, and the AC centrifugal fan 5 passes through the electric air valve 4 to the cold air passage. The cold air is blown in 2 miles, and the AC centrifugal fan 5 is installed in the overhead l...
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The invention discloses a multi-combined heat pipe cooling system with an underfloor type microchannel heat exchanger. The multi-combined heat pipe cooling system with the underfloor type microchannelheat exchanger comprises cabinets, cold air channels, centrifugal fans, microchannel heat exchangers and an empty space. The empty space is arranged under the cabinets; end parts of the empty space are opened; one cold air channel is left between each two cabinets; one centrifugal fan is arranged under each cold air channel, blows cold air into each cold air channel through an electric air valve,and is arranged in the empty space; and one microchannel heat exchanger is further connected onto each centrifugal fan. Compared with a traditional cold channel closed type heat radiation, the multi-combined heat pipe cooling system with the underfloor type microchannel heat exchanger provided by the invention is convenient and practical; the microchannel heat exchanger is arranged underfloor andconcentratedly carries out heat exchange, so that compared with each cabinet back plate heat exchange method, heat exchange is more concentratedly carried out, and the heat exchange efficiency is higher; in addition, the centrifugal fans are adopted for exchanging heat, so that the heat exchange speed is faster; and machine room dust is filtered through filter screens, so that the cabinets in a machine room suck less dust, and the service life is prolonged.
Description
technical field [0001] The invention relates to the technical field of cooling for communication equipment rooms, in particular to a bottom-mounted multi-connected heat pipe cooling system for micro-channel heat exchangers. Background technique [0002] The problem of heat dissipation and power consumption in the computer room has always been an important factor that needs to be considered in the communication computer room. The traditional precision air conditioner has always restricted the development of the communication computer room due to the problem of power consumption. Recently, a new type of water-cooled backplane has also appeared in China, but there are always potential safety hazards in the operation of the computer room in a water environment, and the contact area between the hot air and the backplane of the traditional backplane heat dissipation structure is too small, the utilization rate is not high, and the heat dissipation effect is not good. obvious. Co...
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IPC IPC(8): F24F5/00F24F13/30
CPCF24F5/0007F24F13/30
Inventor 雍亚男
Owner 镇江常畅光伏电子有限公司