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A new heat pipe structure

A heat pipe and vertical pipe technology, applied in the field of heat pipes with new structures, can solve the problems of small heat absorption range at the evaporation end, uneven heat absorption, affecting the heat absorption area of ​​the evaporation end, etc., so as to avoid local overheating or supercooling, absorption The effect of increased thermal area and compact structure

Active Publication Date: 2019-03-19
SHANDONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the shape of the heat pipe affects the heat-absorbing area of ​​the evaporating end, so the heat-absorbing range of the evaporating end is generally relatively small, and sometimes it is necessary to install multiple heat pipes in the heat source to meet the heat-absorbing demand; and when there are multiple evaporating ends, Because each evaporation end is in a different position of the heat source, it will produce uneven heat absorption.

Method used

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  • A new heat pipe structure
  • A new heat pipe structure
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Embodiment Construction

[0032] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0033] In this article, if there is no special explanation, when involving formulas, " / " means division, and "×" and "*" mean multiplication.

[0034] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0035] A heat pipe, comprising a vertical part 1, a horizontal part 2 and a vertical pipe 3, wherein the bottom end of the vertical part 1 communicates with the horizontal part 2, and the horizontal part 2 is from the bottom end of the vertical part 1 to the direction away from the vertical part 1, the lower part of the horizontal part 2 communicates with a plurality of vertical pipes 3, wherein the vertical pipes 3 are the evaporation end of the heat pipe, and the vertical part 1 is the condensation end of the heat pipe.

[0036] During operation, the heat pi...

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Abstract

The invention provides a heat accumulator radial penetration density optimized design method which comprises a heat accumulator. The evaporation end of a heat pipe is arranged in the heat accumulator.The heat accumulator is arranged in a heat source. The condensation end of the heat pipe is arranged in a container above the evaporation end. The evaporation end comprises a plurality of evaporationpipes extending downwards. Copper pipes are arranged between the adjacent evaporation pipes. The copper pipes are designed according to the rule that the distance between the copper pipes and the center of the heat accumulator is S, then the number of the copper pipes is designed as G(S), and G'(S)>0. According to the method, through optimized design of the number of the copper pipes, the effectthat liquid can be heated evenly as soon as possible in the heating process can be guaranteed.

Description

technical field [0001] The invention relates to a heat pipe technology, in particular to a heat pipe with a new structure. Background technique [0002] Heat pipe technology is a heat transfer element called "heat pipe" invented by George Grover of Los Alamos National Laboratory in the United States in 1963. It makes full use of the principle of heat conduction and phase change medium. The rapid heat transfer properties of the heat pipe quickly transfer the heat of the heating object to the heat source, and its thermal conductivity exceeds that of any known metal. [0003] Heat pipe technology was widely used in aerospace, military and other industries before. Since it was introduced into the radiator manufacturing industry, people have changed the traditional radiator design ideas and got rid of the single heat dissipation mode that only relies on high air volume motors to obtain better heat dissipation. The use of heat pipe technology enables the radiator to obtain a sati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/02
CPCF22B1/00F28D15/02F28D20/02Y02E60/14
Inventor 冷学礼邱燕田茂诚张冠敏缪庆庆周翔宇李宏刘宗杰徐永萍轩诗鹏李静马俊迪朱国梁樊相臣魏姗姗陈书祥刘建文张雪缘吕雯李燕王永彬李一真
Owner SHANDONG UNIV
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