A kind of method of vacuum cyanide-free electroplating to prepare high sulfur resistance pure silver coating
A cyanide-free silver-plating and vacuum silver-plating technology is applied in the field of electroplating, which can solve the problems of decreased electrical conductivity of the electrical contact material of the silver-plated layer, poor electrical conductivity of silver sulfide, and heating failure of the isolating switch, and achieves good wear resistance, Good electrical conductivity and good sulfur resistance
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Embodiment 1
[0024] (1) Configuration of cyanide-free silver plating solution
[0025] Main components of silver plating solution: AgNO 3 20 g / L, KI 300 g / L, K 2 CO 3 10 g / L, K 2 C 2 o 4 10 g / L, pH 10.
[0026] (2) Preparation of vacuum pure silver coating
[0027] Copper substrate surface treatment: firstly use 800-mesh sandpaper to polish the copper substrate to remove surface burrs, difficult to accommodate, corrosion marks and scale, and then use 1000-mesh sandpaper to polish the copper substrate to make the surface of the copper substrate smooth and flat. The polished copper substrate was rinsed with deionized water, immersed in 50 g / L NaOH solution for 3 min, then taken out, then soaked in deionized water at room temperature for 5 s, immersed in 10wt% nitric acid solution for 30 s, and then taken out , and finally soaked in deionized water at room temperature for 10 s.
[0028] Vacuum silver plating: the copper substrate after surface treatment is charged and put into the pla...
Embodiment 2
[0031] (1) Configuration of cyanide-free silver plating solution
[0032] Main components of silver plating solution: AgNO 3 30 g / L, KI 350 g / L, K 2 CO 3 15 g / L, K 2 C 2 o 4 15 g / L, pH 11.
[0033] (2) Preparation of vacuum pure silver coating
[0034] Copper surface treatment: firstly use 800-mesh sandpaper to polish the copper substrate to remove surface burrs, difficult to accommodate, corrosion marks and scale, and then use 1000-mesh sandpaper to polish the copper substrate to make the surface of the copper substrate smooth and flat. The polished copper substrate was rinsed with deionized water, immersed in 70 g / L NaOH solution for 5 min, then taken out, then soaked in deionized water at room temperature for 15 s, immersed in 20 wt% nitric acid solution for 1 min, and then taken out , and then soaked in room temperature deionized water for 20 s.
[0035] Vacuum silver plating: the copper substrate after surface treatment is charged and placed in the plating tank fo...
Embodiment 3
[0038] (1) Configuration of cyanide-free silver plating solution
[0039] Main components of silver plating solution: AgNO 3 40 g / L, KI 400 g / L, K 2 CO 3 20g / L, K 2 C 2 o 4 20g / L, pH 12.
[0040] (2) Preparation of vacuum pure silver coating
[0041] Copper surface treatment: firstly use 800-mesh sandpaper to polish the copper substrate to remove surface burrs, difficult to accommodate, corrosion marks and scale, and then use 1000-mesh sandpaper to polish the copper substrate to make the surface of the copper substrate smooth and flat. The polished copper substrate was rinsed with deionized water, immersed in 90 g / L NaOH solution for 7 min, then taken out, then soaked in deionized water at room temperature for 20 s, immersed in 30 wt% nitric acid solution for 2 min, and then taken out , and then soaked in room temperature deionized water for 30 s.
[0042]Vacuum silver plating layer: The copper substrate after surface treatment is charged and put into the plating tan...
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