A method for forming a flexible printed circuit board
A flexible printing and forming method technology, which is applied in printed circuit manufacturing, printed circuit, circuit board tool positioning, etc., can solve problems such as step difference or burr, affect product appearance, affect product bending and conduction performance, etc., and achieve improvement Molding accuracy and the effect of reducing the scrap rate
Active Publication Date: 2020-01-21
SHENZHEN SHIRUITAI TECH
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Problems solved by technology
[0004] In the process of punching flexible printed boards with multiple sets of molds, at the junction of each mold and the mold, due to the error in precision and the expansion and contraction of the material of the product itself, there will often be gaps or burrs after punching. And other problems, affect the appearance of the product, and seriously affect the bending and conduction performance of the product
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[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0016] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or collections thereof.
[0017] It should also be understood that the terminology used ...
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An embodiment of the invention discloses a flexible printed board forming method. The method includes: according to board splicing appearance of a flexible printed board, adding target positioning holes in the flexible printed board, wherein most of the target positioning holes are formed at a combining position of multiple times of punching; drilling and forming the target positioning holes; designing a die punching process corresponding to a target positioning hole area, and punching and forming the flexible printed board. According to a production board splicing mode of the flexible printedboard, the target positioning holes are designed at the combining position of multiple times of punching and drilled out before punching, and areas, where section difference, burrs and excessive flash are possible to be generated, of each punching knife interface area are drilled off in advance, so that the problems of the section difference, the burrs and the excessive flash generated at positions punched for multiple times in the process of forming the flexible printed board are avoided effectively, forming accuracy of the flexible printed board is improved, and scrappage of the punching process is lowered.
Description
technical field [0001] The invention relates to the technical field of electronic manufacturing, in particular to a forming method of a flexible printed board. Background technique [0002] Flexible printed circuit boards (FPC, Flexible Printed Circuit) and rigid-flex printed boards have been widely used in the fields of high-end consumer electronics, medical equipment, automobiles and avionics based on their foldability and high reliability. [0003] It is precisely because of the excellent wrapping characteristics of flexible printed boards that flexible printed boards are usually used in areas with high requirements for line accuracy and shape accuracy. The texture is soft, which leads to extremely high requirements for the precision of the mold in the shape forming process. Furthermore, due to the foldability of the flexible circuit board, it often has irregular geometric shapes and complex shapes. Usually, it is necessary to use two sets and The above molds can complet...
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IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/0266H05K3/0008H05K3/0014H05K3/0044
Inventor 彭勇王文剑杨世勇陈伟
Owner SHENZHEN SHIRUITAI TECH