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UV-LED ink jet printing welding-resistance ink as well as preparation method and application thereof

A UV-LED and inkjet printing technology, applied in applications, inks, household appliances, etc., can solve problems such as cumbersome operation, a large amount of industrial wastewater, and environmental pollution, and achieve improved curing, good acid and alkali resistance, and adhesion good effect

Active Publication Date: 2018-06-29
佛山英捷力新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the heat-curing solder resist ink used in screen printing needs to go through the steps of screen printing, exposure and development during use, the operation is cumbersome, and the development step will generate a large amount of industrial wastewater. Therefore, the ink of the traditional screen printing method exists. To solve the problem of environmental pollution, it is of great significance to develop new environmentally friendly printing inkjet inks

Method used

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  • UV-LED ink jet printing welding-resistance ink as well as preparation method and application thereof
  • UV-LED ink jet printing welding-resistance ink as well as preparation method and application thereof
  • UV-LED ink jet printing welding-resistance ink as well as preparation method and application thereof

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preparation example Construction

[0041] The preparation method of this UV-LED inkjet printing solder resist ink comprises the following steps:

[0042] 1) Mix and stir the modified epoxy acrylate monoester and the nano color paste, and set aside;

[0043] 2) Dissolve the curing agent and the photoinitiator in the active diluent, mix evenly, and set aside;

[0044] 3) Mix and stir the mixture obtained in step 1), the mixture obtained in step 2) and the additive, and filter to obtain the UV-LED inkjet printing solder resist ink.

[0045]Preferably, in step 1) of the preparation method, the synthesis method of the modified epoxy acrylate monoester is: under the protection of an inert gas, mix and stir the modified epoxy resin and p-hydroxyanisole and heat up to 88°C-92°C ℃, then add the mixed liquid composed of acrylic monomer and triphenylphosphine, and then keep the reaction at 98℃~102℃ for at least 5 hours, until the acid value of the measurement system is lower than 5mgKOH / g, the reaction is terminated, and...

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Abstract

The invention discloses a UV-LED ink jet printing welding-resistance ink as well as a preparation method and application thereof. The UV-LED ink jet printing welding-resistance ink is prepared from the following raw materials in parts by mass: 5-15 parts of modified epoxy monoacrylate, 2-6 parts of a curing agent, 60-80 parts of an active diluent, 3-10 parts of a nanometer color paste, 3-10 partsof a photoinitiator and 0.1-3 parts of an additive, wherein the active diluent is at least one of a single-functional monomer, a double-functional monomer and polyfunctional monomer; and the additiveis at least one of a flow agent and a defoaming agent. The invention also discloses the preparation method and a using method of the UV-LED ink jet printing welding-resistance ink. The UV-LED ink jetprinting welding-resistance ink provided by the invention has the characteristics of good adhesive force, good acid and alkali resistance, good thermal shock resistance, high hardness and the like.

Description

technical field [0001] The invention relates to a UV-LED inkjet printing solder resist ink and a preparation method and application thereof. Background technique [0002] Printed circuit board (PCB) is the provider of electrical connection of electronic components, and plays a very important role in many electronic devices. In the production process of printed circuit boards, in order to improve the welding efficiency and avoid damage to parts that do not need to be welded, these parts need to be protected. At this time, solder resist ink is required. [0003] Traditional printed circuit board solder resist inks can be divided into four categories according to the preparation process, including dry film forming, thermosetting forming, ultraviolet (UV) curing forming and photoimaging curing forming. UV curing molding is widely used because of its fast curing speed, less solvent used, and high line precision. At present, the process of printing circuit board solder resist in...

Claims

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Application Information

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IPC IPC(8): C09D11/38C09D11/30C08G59/50C08G59/68
CPCC08G59/504C08G59/686C09D11/30C09D11/38
Inventor 王小妹梁智昊封亮廷伍雪芬
Owner 佛山英捷力新材料科技有限公司
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