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Chip failure repair method, device and equipment

A fault repair and fault recovery technology, which is applied in the direction of measuring devices, instruments, electronic circuit testing, etc., can solve problems such as long fault repair time

Active Publication Date: 2020-07-03
北京物芯科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a chip fault repair method, device, and equipment to solve the problem of long fault repair time caused by the need to reset the entire chip in existing fault repair methods

Method used

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  • Chip failure repair method, device and equipment
  • Chip failure repair method, device and equipment
  • Chip failure repair method, device and equipment

Examples

Experimental program
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Embodiment 1

[0048] The chip provided by the present invention includes a top-level reset module and several upper-level logic modules, at least one upper-level logic module includes a lower-level reset module, several lower-level logic modules, and a lower-level configuration module. Refer to Figure 1a as shown, Figure 1a A schematic diagram of the hierarchical division of the chip is given in . according to actual condition, Figure 1a The secondary logic module may also include several tertiary logic modules, a tertiary configuration module and a tertiary reset module. During specific implementation, the number of levels for dividing the chip into levels may be determined according to actual conditions, which is not limited in this embodiment of the present invention.

[0049] Wherein, the top-level reset module is used to generate a reset signal, and the next-level reset module is used to reset the logic module and / or configuration module of the level according to the reset signal, an...

Embodiment 2

[0090] Based on the same inventive concept, an embodiment of the present invention also provides a chip fault repair device. Since the problem-solving principle of the above-mentioned device is similar to the chip fault repair method, the implementation of the above-mentioned device can refer to the implementation of the method. No longer.

[0091] The chip in the embodiment of the present invention includes a top-level reset module and several upper-level logic modules, at least one upper-level logic module includes a lower-level reset module, several lower-level logic modules, and a lower-level configuration module , wherein the top-level reset module is used to generate a reset signal, the next-level reset module is used to reset the logic module and / or configuration module of the level according to the reset signal, and the logic module is used to implement The logical function of the chip; the configuration module is used to provide configuration information for the logic...

Embodiment 3

[0102] Embodiment 3 of the present application provides a non-volatile computer storage medium, the computer storage medium stores computer executable instructions, and the computer executable instructions can execute the method for repairing a chip failure in any of the above method embodiments.

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Abstract

The invention discloses a fault repairing method, device and equipment for a chip. The method comprises the following steps: pre-dividing the chip to separate a logic module from a configuration module in the chip; when the chip is detected to be faulted, generating, by a top-layer reset module, configuration and non-configuration reset signals, and sending the reset signals to reset modules at all levels to enable the reset module at any level to only execute reset operation on the logic module to realize quick repairing treatment for the chip fault if the non-configuration reset signal is afirst preset value and the configuration reset signal is a second preset value. In addition, as multiple chip faults are caused by the logic module, the method provided by the invention is adopted topreferentially reset all the logic modules to enable the logic modules to return to initial states to repair the chip faults. Therefore, the chip fault can be repaired without using a reset configuration module, and the fault repairing time is greatly shortened.

Description

technical field [0001] The invention relates to the technical field of switching network chip design, in particular to a chip fault repair method, device and equipment. Background technique [0002] When the switching network chip fails, the chip is usually reset by forcibly pulling down or pulling up the reset pin of the chip, or by configuring the reset register through software. Fault recovery is then performed by software reconfiguration of table entries and registers. However, due to the huge number of table entries and registers in the network chip, when the switch chip malfunctions and needs to be repaired, it takes a lot of time to perform related configurations from power-on reset to normal operation, resulting in the traditional fault repair method taking a long time. Long, and the long-term paralysis of the network is bound to bring unpredictable losses. [0003] Therefore, how to quickly restore the switching network chip when it fails is one of the technical p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2851
Inventor 李文军
Owner 北京物芯科技有限责任公司