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Multilayer Ceramic Electronic Components

A technology for electronic components and ceramic capacitors, applied in the field of laminated ceramic electronic components, can solve problems such as functional disorders, and achieve the effect of preventing moisture intrusion

Active Publication Date: 2021-10-19
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, if the thickness of each of the above-mentioned dielectric edge portions is reduced, for example, to 10 μm or less, moisture will easily penetrate into the capacitor body through each dielectric edge portion, so the internal electrode layer will be corroded by the moisture to cause functional failure. high risk

Method used

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  • Multilayer Ceramic Electronic Components
  • Multilayer Ceramic Electronic Components
  • Multilayer Ceramic Electronic Components

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach 》

[0067] This first embodiment is an embodiment in which the present invention is applied to a multilayer ceramic capacitor. First, use Figure 1 to Figure 5 , the structure of the multilayer ceramic capacitor 10 according to the first embodiment of the present invention will be described. In addition, in the following description, for the convenience of explanation, among the six faces of the substantially rectangular parallelepiped capacitor main body 11 described later, the opposing directions of the two facing faces (equivalent to figure 1 The left and right direction) is expressed as the first direction, and the relative direction of the other two relative surfaces (equivalent to figure 1 The up and down direction) is expressed as the second direction, and the relative directions of the other two relative surfaces (equivalent to figure 2 The up and down directions of ) are denoted as a third direction, and the dimensions along each direction are denoted as a first direct...

no. 2 approach 》

[0102] This second embodiment is an embodiment in which the present invention is applied to a multilayer ceramic capacitor. First, use Figure 7 ~ Figure 11 , the structure of the multilayer ceramic capacitor 20 according to the second embodiment of the present invention will be described. In addition, in the following description, for the convenience of explanation, among the six faces of the substantially rectangular parallelepiped capacitor main body 11 described later, the opposing directions of the two facing faces (equivalent to Figure 7 The left and right direction) is expressed as the first direction, and the relative direction of the other two relative surfaces (equivalent to Figure 7 The up and down direction) is expressed as the second direction, and the relative directions of the other two relative surfaces (equivalent to Figure 8 The up and down direction) is represented as a third direction, and the dimensions in each direction are represented as a first dir...

no. 3 approach 》

[0135] This third embodiment is an embodiment in which the present invention is applied to a multilayer ceramic capacitor. First, use Figure 13 with Figure 14 (C) describes the structure of the multilayer ceramic capacitor 30 according to the third embodiment of the present invention. In addition, in the following description, for the convenience of explanation, among the six faces of the substantially rectangular parallelepiped capacitor main body 11 described later, the opposing directions of the two facing faces (equivalent to Figure 14 The left and right direction of (C)) is expressed as the first direction, and the relative direction of the other two opposing surfaces (equivalent to Figure 14 The front and rear direction of (C)) is expressed as the second direction, and the relative directions of the other two opposing surfaces (equivalent to Figure 14 The upper and lower directions of (C)) are represented as a third direction, and the dimensions in each direction...

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Abstract

The present invention provides a multilayer ceramic electronic component capable of preventing moisture intrusion into a component main body as much as possible even when the thickness of the multilayer ceramic electronic component is reduced. One face in the third direction of a capacitor body (11) of a laminated ceramic capacitor (10) is provided with a first insulator layer having portions (A1) and (A2) covered by the first portion (12b) of each external electrode (12) (13‑1), the other face of the third direction of the capacitor body (11) is provided with a second insulator having parts (A3) and (A4) covered by the second part (12c) of each external electrode (12) layer (13-2).

Description

technical field [0001] The present invention relates to laminated ceramic electronic components such as laminated ceramic capacitors and laminated ceramic inductors. Background technique [0002] Multilayer ceramic electronic components such as multilayer ceramic capacitors and multilayer ceramic inductors, such as multilayer ceramic capacitors, generally include: a substantially rectangular parallelepiped-shaped capacitor body having a capacitor portion in which a plurality of internal electrode layers are stacked with dielectric layers interposed therebetween; A pair of external electrodes of the capacitor body. One external electrode is connected to a part of the multiple internal electrode layers, and the other external electrode is connected to the remaining multiple internal electrode layers. [0003] Among the mounting methods of the above-mentioned multilayer ceramic capacitors, in addition to the mounting method of being arranged on the surface of the circuit board...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01G4/232H01G4/224H01G4/12
CPCH01G4/224H01G4/232H01G4/30H01G4/12H01G4/012H01G4/1245H01G4/1227H01G4/1236
Inventor 笹木隆佐藤壮饭岛淑明
Owner TAIYO YUDEN KK