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A kind of led packaging technology

A technology of LED packaging and process, applied in semiconductor devices, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of package brightness reduction, dead light, failure, etc.

Active Publication Date: 2020-10-30
台州市领拓塑业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this process, there may be improper welding wire parameters, which will cause dead lights and cause LED failure, and the silver glue will absorb a small amount of light energy and reduce the brightness of the package.

Method used

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  • A kind of led packaging technology
  • A kind of led packaging technology
  • A kind of led packaging technology

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Embodiment Construction

[0025] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0026] An LED packaging process, comprising the following steps: S1: applying silver glue on a bracket by dispensing equipment, and then bonding a chip to the silver glue to obtain an LED; S2: performing a crystal-bonding operation on the LED with a crystal-bonding mechanism, The specific principle is the existing technology, so I won’t go into details; then use a dryer to bake the LED for 2 hours at a temperature of 150°C; S3: Use the molding equipment to mold the LED for the first time, and the molding operation and principle are existing S4: Use fluorescent coating equipment to coat fluorescent film on LED, and the specific coating principle will not be repeated; S5: Use dr...

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PUM

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Abstract

The invention discloses an LED packaging process. The LED packaging process comprises the following steps: first, bonding a chip and an FPC (Flexible Printed Circuit) with silver sol, then carrying out die bonding on an LED with a die bonder, and carrying out mold pressing on the LED for the first time with a mold pressing device; then, coating a fluorescent film on the LED with a fluorescent coating device, and carrying out mold pressing on the LED for the second time with the mold pressing device; and finally, packaging the LED with a packaging machine, and warehousing packaged LED bubbles.The LED packaging process provided by the invention breaks through the traditional packaging process, uses a flip chip bonding mode to play a conductive role, does not need gold wire connection, reduces LED failure caused by bonding wire problems, and has a better heat dissipation effect.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to an LED packaging process. Background technique [0002] At present, most of the LEDs on the market adopt the traditional packaging form, the wire bonding type, that is, the chip and the bracket are connected with gold wires. This process may cause dead light due to improper bonding wire parameters falling off between the gold ball and the electrode, making the LED invalid, and using silver glue to bond the crystal will absorb a small amount of light energy, reducing the brightness of the package. Contents of the invention [0003] In view of the above problems, the present invention provides an LED packaging process with long service life of the manufactured LED. [0004] In order to achieve the above object, the present invention adopts the following technical solutions: an LED packaging process, comprising the following steps: [0005] S1: Put silver glue ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/00H01L21/67
CPCH01L21/67121H01L33/005H01L33/52
Inventor 程一龙郭经洲王晓哲李辉
Owner 台州市领拓塑业有限公司