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Automatic heating device for integrated circuit packaging equipment

A technology for packaging equipment and automatic heating, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc. It can solve the problems of limited heating range, poor flexibility, and inability to move freely, so as to increase the heating range and enhance flexibility. Effect

Active Publication Date: 2018-07-06
河北达实信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies in the prior art, the object of the present invention is to provide an automatic heating device for integrated circuit packaging equipment, so as to solve the problem that the automatic heating device for integrated circuit packaging equipment in the prior art can only heat at a fixed point, and it cannot freely Movement, limited heating range, poor flexibility defects

Method used

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  • Automatic heating device for integrated circuit packaging equipment
  • Automatic heating device for integrated circuit packaging equipment
  • Automatic heating device for integrated circuit packaging equipment

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Embodiment Construction

[0023] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0024] see Figure 1-Figure 5 , the present invention provides a technical solution for an automatic heating device for integrated circuit packaging equipment: its structure includes a device base 1, a movable self-starting heating device 2, a supporting leg 3, a packaging table 4, a transmission device 5, and a transmission protection Cover 6, machine cover 7, work indicator light 8, control computer 9, control panel 10, radiation coating layer 11, encapsulation glue coating device 12, described movable type self-starting heating device 2 is arranged on the inside of device base 1, and described movable The type self-starting heating device 2 is connected with the control computer 9 and the control panel 10. The supporting legs 3 are arranged at ...

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Abstract

The invention discloses an automatic heating device for integrated circuit packaging equipment. The automatic heating device structurally comprises a device base, a movable self-start heating device,a support leg column, a packaging table, a conveying device, a conveying protection cover, a machine hood, a work indicator lamp, a control computer, a control panel, a radiation coating layer and a packaging glue application device; the movable self-start heating device is arranged in the device base and connected with the control computer and the control panel. According to the automatic heatingdevice, through the arrangement of the movable self-start heating device, a heater can be driven to slide left and right and back and forth, the heating range is enlarged, the automatic heating device has the functions of instant start and stop at the same time, the electricity and energy are saved, and the flexibility and environmental protection and energy saving performance of the automatic heating device are effectively improved.

Description

technical field [0001] The invention relates to an automatic heating device for integrated circuit packaging equipment, which belongs to the field of integrated circuit packaging equipment. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter "IC" in the circuit. [0003] However, the automatic heating device used for integrated circuit packaging equipment in the prior art can only be heated at a fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67115H01L21/67126
Inventor 金凯
Owner 河北达实信息技术有限公司