SCR structure and ESD protection structure having same
A technology for ESD protection and heavily doped regions, applied to electrical components, transistors, diodes, etc., can solve problems such as poor ESD protection capability, low maintenance voltage, and increased leakage of diodes, and achieve convenient and adjustable turn-on voltage. The effect of high sustaining voltage and high integration
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[0046] like figure 1 As shown, the present invention provides an SCR structure, an NMOS is formed on one side of the SCR, and a diode is formed on the other side of the SCR.
[0047] The SCR structure includes: first P well PW1, second P well PW2, first N well NW1, second N well NW2, polysilicon gate G, first to fourth P-type heavily doped regions P+1 to P +4 and the first to fifth N-type heavily doped regions N+1 to N+5;
[0048] The first P well PW1, the second P well PW2, the first N well NW1 and the second N well NW2 are alternately arranged on the upper part of the substrate from left to right;
[0049] A first P-type heavily doped region P+1 is arranged on the upper part of the first P well PW1, and a first N-type heavily doped region N is arranged in the first P well PW1 on the right side of the first P-type heavily doped region P+1. +1, the second N-type heavily doped region N+2 is set in the first P well PW1 on the right side of the first N-type heavily doped region...
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