Photosensor component and electronic device having same

A technology of photosensitive devices and electronic devices, which is applied to electrical components, telephone communications, telephone structures, etc., can solve the problems of large printed circuit board size, large size, and poor fool-proof effect, so as to reduce the occupied space and improve Anti-fooling effect, realize the effect of thinning

Active Publication Date: 2020-09-04
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the light-sensitive silicone sleeve is very soft, it is easy to deform and has poor anti-fooling effect
In addition, this method makes the size of the printed circuit board larger in the thickness direction, which in turn makes the size of the electronic device larger in the thickness direction, which is not conducive to the thinning of the electronic device

Method used

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  • Photosensor component and electronic device having same
  • Photosensor component and electronic device having same
  • Photosensor component and electronic device having same

Examples

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Embodiment Construction

[0021] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application.

[0022] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "top", " The orientation or positional relationship indicated by "bottom", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the referred device or element must have Certain ori...

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PUM

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Abstract

The application discloses a light sensor component and an electronic device with the same. The light sensor comprises a main board, a light-sensing device, and a cover body, wherein the light-sensingdevice is arranged on the main board and connected with the main board; N ridges are formed on the peripheral wall of the light-sensing device; a groove extending along the length direction of the ridges of n adjacent ridges, wherein n is more than 0 and not more than N-1; the cover body is covered on the light-sensing device, the inner peripheral wall of the cover body is cooperated with the peripheral wall of the light-sensing device, and a bulge cooperated with the groove is arranged at n adjacent ridges corresponding to the groove on the inner peripheral wall of the cover body, and the bulge extends along the length direction of the ridge of the cover body. According to the light-sensor component disclosed by the application, an operation of reversely installing the cover when the light-sensing device is assembled can be prevented, and good poka-yoke effect is provided. Furthermore, the connection fixation of the cover body and the light-sensing device can be realized through the cooperation of the groove and the bulge, the size of the light-sensor component can be reduced, and the occupied space in the electronic device is reduced.

Description

technical field [0001] The present application relates to the technical field of electronic devices, in particular, to a photosensor component and an electronic device having the same. Background technique [0002] The outer end of the photosensor component is covered with a photosensitive silicone sleeve to prevent the optical path interference between the receiving end and the transmitting end of the photosensitive device. A printed circuit board (PCB) is arranged under the photosensitive device, and a snap-in interface is arranged on the printed circuit board, and a swing arm extending into the snap-in interface is provided on the photosensitive silicone sleeve to realize the fixing of the seal and anti-reverse function. Since the light-sensitive silicone sleeve is very soft, it is easy to deform and has poor anti-fooling effect. In addition, this method makes the size of the printed circuit board larger in the thickness direction, and further makes the size of the elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/02
CPCH04M1/026H04M1/0277
Inventor 苏建斌
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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