Pattern electroplating method of PCB

Abstract

The invention discloses a pattern electroplating method of a PCB. The pattern electroplating method comprises the following steps of (1) acid degreasing, wherein the PCB is put in acid degreasing liquid with the temperature ranging from 35 DEG C to 45 DEG C, the process is maintained for 3 min to 5 min, and grease on the face of the PCB is removed; (2) microetching, wherein the PCB is put in microetching liquid with the temperature ranging from 26 DEG C to 30 DEG C, the process is maintained for 1 min to 2 min, board face oxidization is removed, and the board face is coarsened; (3) copper plating, wherein copper plating liquid is prepared, the PCB is put in the copper plating liquid with the temperature ranging from 22 DEG C to 28 DEG C, copper plating is carried out with the current density being 1-3 A / dm<2>, and the copper layer in the board face and a hole is thickened; and (4) pure tin plating, wherein tin plating liquid is prepared, the PCB is put in the tin plating liquid with the temperature ranging from 19 DEG C to 25 DEG C, the circuit pattern surface is plated with a pure tin anti-etching layer, and pattern electroplating of the PCB is completed. According to the patternelectroplating method of the PCB, the uniform thickened copper layer with the thickness meeting the requirement can be formed in the board face and the hole, and the circuit pattern surface is electroplated to form an anti-etching layer for effectively protecting a circuit.

Description

technical field [0001] The invention relates to an electroplating process, in particular to a PCB pattern electroplating method. Background technique [0002] Pattern electroplating, the process of thickening the copper layer on the surface of the board and in the hole by electroplating, and electroplating a resist layer on the surface of the circuit pattern to protect the circuit. [0003] In the existing graphic electroplating process, due to the unreasonable specific parameters of each process, there are the following deficiencies: [0004] (1) In the degreasing process, the film layer will be peeled off from the copper surface, and there will be seepage during copper plating, which will make the board scrapped; impurities will remain on the board surface, which may cause circuit gaps; [0005] (2) In the micro-etching process, excessive micro-etching will occur, resulting in no copper in the holes on the board, or peeling of the copper layer, and the board will be scrap...

AI Technical Summary

Problems solved by technology

[0004] (1) In the degreasing process, the film layer will be peeled off from the copper surface, and there will be seepage during copper plating, which will make the board scrapped; impurities will remain on the board surface, which may cause circuit gaps;

[0005] (2) In the micro-etching process, excessive micro-etching will occur, resulting in no copper in the holes on the board, or peeling of the copper layer, and the board will be scrapped;

[0006] (3) In the copper plating process, the copper plating time is too long, causing the copper layer in the circuit and the hole to be plated too thick, which may cause fine holes; the copper plating time is too short, resulting in insufficient thickness of the copper plating layer to meet the cloth requirements Scrap; board surface coating is dull, rough, high potential areas have burning board and other phenomena;

[0007] (4) In the tin plating process, the thickness of the tin plating layer is too thick or too thin, the tin plating layer that is too thin will not have a protective effect, and the tin plating layer that is too thick will cause film clipping or incomplete etching